Part Details for TMP93CW41DF by Toshiba America Electronic Components
Results Overview of TMP93CW41DF by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
TMP93CW41DF Information
TMP93CW41DF by Toshiba America Electronic Components is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for TMP93CW41DF
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 160 |
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RFQ |
Part Details for TMP93CW41DF
TMP93CW41DF CAD Models
TMP93CW41DF Part Data Attributes
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TMP93CW41DF
Toshiba America Electronic Components
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Datasheet
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TMP93CW41DF
Toshiba America Electronic Components
IC 16-BIT, 20 MHz, MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100, Microcontroller
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | QFP | |
| Package Description | 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Additional Feature | OPERATES AT 2.7V MIN SUPPLY @ 12.5 MHZ | |
| Address Bus Width | 24 | |
| Bit Size | 16 | |
| CPU Family | TLCS-900/L | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G100 | |
| Length | 14 mm | |
| Number of I/O Lines | 61 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 4096 | |
| Seated Height-Max | 1.6 mm | |
| Speed | 20 MHz | |
| Supply Current-Max | 30 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
TMP93CW41DF Frequently Asked Questions (FAQ)
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Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the top and bottom layers to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
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To ensure reliable operation in high-temperature environments, it is recommended to derate the power consumption and operating frequency according to the temperature derating curve provided in the datasheet. Additionally, ensure proper thermal design and heat sinking to keep the junction temperature within the recommended range.
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Toshiba recommends a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max) to prevent damage to the device. A soldering iron with a temperature control is recommended.
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The TMP93CW41DF is not designed for use in high-humidity environments. If operation in high humidity is required, additional protection measures such as conformal coating or hermetic sealing may be necessary to prevent moisture ingress.
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Toshiba recommends storing the TMP93CW41DF in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the device in direct sunlight or near heat sources.