Part Details for TMP92FD54AIF by Toshiba America Electronic Components
Results Overview of TMP92FD54AIF by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TMP92FD54AIF Information
TMP92FD54AIF by Toshiba America Electronic Components is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for TMP92FD54AIF
TMP92FD54AIF CAD Models
TMP92FD54AIF Part Data Attributes
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TMP92FD54AIF
Toshiba America Electronic Components
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Datasheet
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TMP92FD54AIF
Toshiba America Electronic Components
IC 32-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100, Microcontroller
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP100,.63SQ,20 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Boundary Scan | NO | |
| CPU Family | TLCS-900 | |
| Clock Frequency-Max | 10 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PQFP-G100 | |
| Length | 14 mm | |
| Number of I/O Lines | 68 | |
| Number of Terminals | 100 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 32768 | |
| ROM (words) | 131072 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 20 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Alternate Parts for TMP92FD54AIF
This table gives cross-reference parts and alternative options found for TMP92FD54AIF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMP92FD54AIF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| TMP92FD54AIFG | Toshiba America Electronic Components | Check for Price | IC 32-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100, Microcontroller | TMP92FD54AIF vs TMP92FD54AIFG |
TMP92FD54AIF Frequently Asked Questions (FAQ)
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Toshiba recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink. Operating the device within its specified temperature range and providing adequate cooling will also help ensure reliable operation.
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Operating the TMP92FD54AIF beyond its specified temperature range can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within its specified temperature range to maintain its performance and reliability.
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To prevent electrostatic discharge (ESD) damage, handle the device with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the assembly process is ESD-controlled, and consider using ESD-protective packaging for storage and shipping.
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Store the TMP92FD54AIF in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the device to extreme temperatures, humidity, or physical stress. Follow proper handling and storage procedures to prevent damage and ensure the device's reliability.