Datasheets
TLV5627CDR by: Texas Instruments

8-Bit, 3 us Quad DAC, Serial Input, Low Power, H/W or S/W Power Down 16-SOIC 0 to 70

Part Details for TLV5627CDR by Texas Instruments

Results Overview of TLV5627CDR by Texas Instruments

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Applications Education and Research Environmental Monitoring Industrial Automation Agriculture Technology Medical Imaging

TLV5627CDR Information

TLV5627CDR by Texas Instruments is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Price & Stock for TLV5627CDR

Part # Distributor Description Stock Price Buy
DISTI # 2156-TLV5627CDR-ND
DigiKey IC DAC 8BIT V-OUT 16SOIC Min Qty: 77 Lead time: 6 Weeks Container: Bulk MARKETPLACE PRODUCT 44428
In Stock
  • 77 $3.9200
$3.9200 Buy Now
DISTI # TLV5627CDR-ND
DigiKey IC DAC 8BIT V-OUT 16SOIC Min Qty: 77 Lead time: 6 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 2,500 $3.8706
$3.8706 Buy Now
DISTI # 595-TLV5627CDR
Mouser Electronics Digital to Analog Converters - DAC 8-Bit 3us Quad DAC S erial Input A 595-TLV5627CD RoHS: Compliant 0
  • 2,500 $3.7600
$3.7600 Order Now
DISTI # 86032170
Verical DAC 4-CH Resistor-String 8-bit 16-Pin SOIC T/R RoHS: Compliant Min Qty: 80 Package Multiple: 1 Date Code: 1101 Americas - 29428
  • 80 $4.7125
  • 100 $4.4750
  • 500 $4.2375
  • 1,000 $4.0000
  • 10,000 $3.7750
$3.7750 / $4.7125 Buy Now
DISTI # 86031098
Verical DAC 4-CH Resistor-String 8-bit 16-Pin SOIC T/R RoHS: Compliant Min Qty: 80 Package Multiple: 1 Date Code: 0001 Americas - 15000
  • 80 $4.7125
  • 100 $4.4750
  • 500 $4.2375
  • 1,000 $4.0000
  • 10,000 $3.7750
$3.7750 / $4.7125 Buy Now
Rochester Electronics TLV5627 8-Bit, 3 us Quad DAC, Serial Input, Low Power, H/W or S/W Power Down RoHS: Compliant Status: Active Min Qty: 1 44428
  • 25 $3.7700
  • 100 $3.5800
  • 500 $3.3900
  • 1,000 $3.2000
  • 10,000 $3.0200
$3.0200 / $3.7700 Buy Now
NexGen Digital   4999
RFQ
LCSC 2.5us SPI 0.3LSB 2.7V5.5V 8Bit SOIC-16 Digital to Analog Converters (DAC) ROHS 8
  • 1 $7.5133
  • 10 $7.3351
  • 30 $7.2163
  • 100 $7.0975
$7.0975 / $7.5133 Buy Now

Part Details for TLV5627CDR

TLV5627CDR CAD Models

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TLV5627CDR Part Data Attributes

TLV5627CDR Texas Instruments
Buy Now Datasheet
Compare Parts:
TLV5627CDR Texas Instruments 8-Bit, 3 us Quad DAC, Serial Input, Low Power, H/W or S/W Power Down 16-SOIC 0 to 70
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code SOIC
Package Description GREEN, PLASTIC, SOIC-16
Pin Count 16
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Analog Output Voltage-Max 5.1 V
Analog Output Voltage-Min
Converter Type D/A CONVERTER
Input Bit Code BINARY
Input Format SERIAL
JESD-30 Code R-PDSO-G16
JESD-609 Code e4
Length 9.9 mm
Linearity Error-Max (EL) 0.1953%
Moisture Sensitivity Level 1
Number of Bits 8
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Sample Rate 0.107 MHz
Seated Height-Max 1.75 mm
Settling Time-Max 18 µs
Settling Time-Nom (tstl) 2.5 µs
Supply Current-Max 5.5 mA
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.905 mm

Alternate Parts for TLV5627CDR

This table gives cross-reference parts and alternative options found for TLV5627CDR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TLV5627CDR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
TLV5627ID Texas Instruments $3.0436 8-Bit, 3 us Quad DAC, Serial Input, Low Power, H/W or S/W Power Down 16-SOIC -40 to 85 TLV5627CDR vs TLV5627ID
TLV5627CDG4 Texas Instruments Check for Price 8-Bit, 3 us Quad DAC, Serial Input, Low Power, H/W or S/W Power Down 16-SOIC 0 to 70 TLV5627CDR vs TLV5627CDG4

TLV5627CDR Related Parts

TLV5627CDR Frequently Asked Questions (FAQ)

  • The TLV5627CDR is a high-frequency device, so it's essential to follow good layout and placement practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using short traces, and avoiding vias under the device. Additionally, decoupling capacitors should be placed as close to the device as possible.

  • The internal voltage regulator of the TLV5627CDR requires a 1-μF ceramic capacitor (X5R or X7R type) connected between the VREG pin and GND. This capacitor helps to stabilize the internal voltage regulator and ensure proper operation.

  • To ensure proper operation, TI recommends powering up the TLV5627CDR in the following sequence: 1) Apply VCC, 2) Apply AVCC, and 3) Apply the input signal. This sequence helps to prevent latch-up and ensures that the device powers up correctly.

  • To optimize the TLV5627CDR's performance, consider the following: 1) Choose the correct output voltage range for your application, 2) Select the appropriate gain setting, 3) Optimize the input impedance, and 4) Use proper filtering and decoupling techniques. Additionally, consult the datasheet and application notes for specific guidance on optimizing performance.

  • The TLV5627CDR is a high-power device, and thermal considerations are essential to ensure reliable operation. Ensure good airflow, use a heat sink if necessary, and follow TI's thermal design guidelines to prevent overheating.

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