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Part Details for TLV2760IDBVT by Texas Instruments
Results Overview of TLV2760IDBVT by Texas Instruments
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
TLV2760IDBVT Information
TLV2760IDBVT by Texas Instruments is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Price & Stock for TLV2760IDBVT
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
3118051RL
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Farnell | OP AMP, RRI/O, SMD, 2760, SOT-23-6 RoHS: Compliant Min Qty: 1 Lead time: 53 Weeks, 2 Days Container: Reel | 4 |
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$2.0494 | Buy Now |
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DISTI #
3118051
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Farnell | OP AMP, RRI/O, SMD, 2760, SOT-23-6 RoHS: Compliant Min Qty: 1 Lead time: 53 Weeks, 2 Days Container: Cut Tape | 4 |
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$2.0494 | Buy Now |
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DISTI #
296-TLV2760IDBVTCT-ND
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DigiKey | IC OPAMP GP 1 CIRCUIT SOT23-6 Min Qty: 1 Lead time: 20 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
1226 In Stock |
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$0.9794 / $1.8800 | Buy Now |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 6 |
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$1.5000 / $2.3100 | Buy Now |
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Win Source Electronics | IC OPAMP GP 500KHZ RRO SOT23-6 | 9800 |
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$1.1060 / $1.6590 | Buy Now |
Part Details for TLV2760IDBVT
TLV2760IDBVT CAD Models
TLV2760IDBVT Part Data Attributes
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TLV2760IDBVT
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
TLV2760IDBVT
Texas Instruments
Single, 3.6-V, 500-kHz, RRIO operational amplifier with shutdown 6-SOT-23 -40 to 85
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | SOT-23 | |
| Pin Count | 6 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Average Bias Current-Max (IIB) | 0.0002 µA | |
| Bias Current-Max (IIB) @25C | 0.000015 µA | |
| Common-mode Reject Ratio-Min | 55 dB | |
| Common-mode Reject Ratio-Nom | 76 dB | |
| Frequency Compensation | YES | |
| Input Offset Current-Max (IIO) | 0.000015 µA | |
| Input Offset Voltage-Max | 3500 µV | |
| JESD-30 Code | R-PDSO-G6 | |
| JESD-609 Code | e4 | |
| Length | 2.9 mm | |
| Low-Bias | YES | |
| Low-Offset | NO | |
| Micropower | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LSSOP | |
| Package Equivalence Code | TSOP6,.11,37 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.45 mm | |
| Slew Rate-Min | 0.07 V/us | |
| Slew Rate-Nom | 0.22 V/us | |
| Supply Current-Max | 0.028 mA | |
| Supply Voltage Limit-Max | 4 V | |
| Supply Voltage-Nom (Vsup) | 2.4 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.95 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Unity Gain BW-Nom | 500 | |
| Voltage Gain-Min | 18000 | |
| Wideband | NO | |
| Width | 1.6 mm |
Alternate Parts for TLV2760IDBVT
This table gives cross-reference parts and alternative options found for TLV2760IDBVT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TLV2760IDBVT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TLV2760IDBVRG4 | Texas Instruments | Check for Price | Single 1.8-V, Micro-power, Rail-to-Rail, Single Supply Amplifier with Shutdown 6-SOT-23 -40 to 85 | TLV2760IDBVT vs TLV2760IDBVRG4 |
| TLV2760IDBV | Texas Instruments | Check for Price | IC OP-AMP, 6800 uV OFFSET-MAX, 0.5 MHz BAND WIDTH, PDSO6, PLASTIC, SOT-23, 6 PIN, Operational Amplifier | TLV2760IDBVT vs TLV2760IDBV |
| TLV2760CDBVT | Texas Instruments | Check for Price | IC OP-AMP, Operational Amplifier | TLV2760IDBVT vs TLV2760CDBVT |
| TLV2760CDBVR | Texas Instruments | Check for Price | IC OP-AMP, Operational Amplifier | TLV2760IDBVT vs TLV2760CDBVR |
TLV2760IDBVT Frequently Asked Questions (FAQ)
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It is recommended to place the TLV2760IDBVT close to the analog signal sources, use a solid ground plane, and keep the input traces short and away from digital signals. Additionally, decoupling capacitors should be placed close to the device's power pins.
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Verify that the supply voltage is within the recommended range of 2.7V to 5.5V, and the operating temperature is within the range of -40°C to 125°C. Also, ensure that the input signals are within the recommended common-mode voltage range.
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The recommended input impedance is 1 kΩ or higher. A lower input impedance can lead to reduced gain accuracy and increased noise sensitivity. It is essential to ensure that the input impedance is within the recommended range to achieve optimal performance.
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Use ESD protection devices, such as TVS diodes or ESD arrays, on the input lines to protect the TLV2760IDBVT from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
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Use a thermal pad on the bottom of the device, and ensure good thermal conductivity between the device and the PCB. Keep the thermal pad away from other components and avoid using thermal vias under the device.