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Part Details for TLV2465ID by Texas Instruments
Results Overview of TLV2465ID by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Available)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
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TLV2465ID Information
TLV2465ID by Texas Instruments is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Price & Stock for TLV2465ID
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-10609-5-ND
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DigiKey | IC OPAMP GP 4 CIRCUIT 16SOIC Min Qty: 1 Lead time: 6 Weeks Container: Tube |
65 In Stock |
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$2.1705 / $3.9900 | Buy Now |
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DISTI #
595-TLV2465ID
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Mouser Electronics | Operational Amplifiers - Op Amps Quad Rail-Rail A 595-TLV2465IDR RoHS: Compliant | 120 |
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$2.1700 / $3.9900 | Buy Now |
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Cytech Systems Limited | IC OPAMP GP 4 CIRCUIT 16SOIC | 40 |
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RFQ |
Part Details for TLV2465ID
TLV2465ID CAD Models
TLV2465ID Part Data Attributes
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TLV2465ID
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
TLV2465ID
Texas Instruments
Quad, 6-V, 5.2-MHz operational amplifier 16-SOIC -40 to 125
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | SOIC | |
| Package Description | GREEN, PLASTIC, MS-012AC, SOIC-16 | |
| Pin Count | 16 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Average Bias Current-Max (IIB) | 0.075 µA | |
| Bias Current-Max (IIB) @25C | 0.014 µA | |
| Common-mode Reject Ratio-Min | 66 dB | |
| Common-mode Reject Ratio-Nom | 85 dB | |
| Frequency Compensation | YES | |
| Input Offset Current-Max (IIO) | 0.007 µA | |
| Input Offset Voltage-Max | 2000 µV | |
| JESD-30 Code | R-PDSO-G16 | |
| JESD-609 Code | e4 | |
| Length | 9.9 mm | |
| Low-Bias | NO | |
| Low-Offset | NO | |
| Micropower | NO | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 4 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP16,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Packing Method | TUBE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Slew Rate-Min | 0.8 V/us | |
| Slew Rate-Nom | 1.6 V/us | |
| Supply Current-Max | 3.6 mA | |
| Supply Voltage Limit-Max | 6 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Unity Gain BW-Nom | 6400 | |
| Voltage Gain-Min | 31622 | |
| Wideband | NO | |
| Width | 3.9 mm |
Alternate Parts for TLV2465ID
This table gives cross-reference parts and alternative options found for TLV2465ID. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TLV2465ID, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TLV2465QDR | Texas Instruments | Check for Price | QUAD OP-AMP, 2200uV OFFSET-MAX, 5.2MHz BAND WIDTH, PDSO16, PLASTIC, MS-012AC, SOIC-16 | TLV2465ID vs TLV2465QDR |
TLV2465ID Frequently Asked Questions (FAQ)
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The maximum power dissipation of the TLV2465ID is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the MSOP package, it is 440mW at 25°C. Refer to the thermal characteristics table in the datasheet for more information.
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To ensure stability in a unity-gain buffer configuration, make sure to use a low-ESR capacitor (e.g., ceramic or film capacitor) with a value between 10nF to 100nF between the output and the inverting input. This capacitor helps to compensate for the op-amp's internal capacitance and ensures stability.
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To minimize noise and EMI, follow these layout and routing guidelines: keep the input and output traces short and away from each other, use a solid ground plane, and avoid running sensitive traces near the op-amp's power pins. Also, use a decoupling capacitor (e.g., 100nF) between the power pins and the ground plane, and place it as close to the op-amp as possible.
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The TLV2465ID is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. If you need to operate the device at high temperatures, ensure that you follow proper thermal management and derating guidelines to avoid overheating and reduce the risk of device failure.
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To prevent electrostatic discharge (ESD) damage, handle the TLV2465ID with care: use an ESD wrist strap or mat, touch a grounded object before handling the device, and avoid touching the device's pins or exposed internal components. Also, ensure that your PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, to protect the device from ESD events.