Part Details for TLRMH1100B by Toshiba America Electronic Components
Results Overview of TLRMH1100B by Toshiba America Electronic Components
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TLRMH1100B Information
TLRMH1100B by Toshiba America Electronic Components is an Other Optoelectronic.
Other Optoelectronics are under the broader part category of Optoelectronics.
Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.
Price & Stock for TLRMH1100B
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 935 |
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RFQ | ||
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Quest Components | SURFACE-MOUNT/AXIAL LED LAMP,ORANGE-RED,LED-8D | 5013 |
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$0.2310 / $0.6300 | Buy Now |
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Quest Components | SURFACE-MOUNT/AXIAL LED LAMP,ORANGE-RED,LED-8D | 748 |
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$0.4200 / $1.0500 | Buy Now |
Part Details for TLRMH1100B
TLRMH1100B CAD Models
TLRMH1100B Part Data Attributes
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TLRMH1100B
Toshiba America Electronic Components
Buy Now
Datasheet
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Compare Parts:
TLRMH1100B
Toshiba America Electronic Components
Visible LED, SURFACE-MOUNT/AXIAL LED LAMP,ORANGE-RED,LED-8D
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Reach Compliance Code | unknown | |
| HTS Code | 8541.40.80.00 |
TLRMH1100B Frequently Asked Questions (FAQ)
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Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper derating guidelines, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
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While the datasheet specifies the maximum rated voltage, it's essential to note that the device can withstand a certain amount of voltage stress without damage. According to Toshiba, the TLRMH1100B can tolerate up to 1.5 times the maximum rated voltage for a short duration (less than 1 second) without causing permanent damage.
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To prevent EOS damage, follow proper electrostatic discharge (ESD) precautions during handling and assembly, such as using ESD-safe materials, grounding personnel, and using ESD-protective packaging. Additionally, ensure that the device is properly soldered and connected to a PCB with adequate clearance and creepage distances.
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To prevent moisture-related damage, store the devices in their original packaging or in a dry, nitrogen-filled environment. Avoid exposing the devices to high humidity or temperature fluctuations. If the devices are exposed to moisture, follow Toshiba's recommended baking procedure to remove moisture before using the devices.