Datasheets
TLP108(F) by: Toshiba America Electronic Components

IC PHOTOCOUPLER IRED 6-MFSOP

Part Details for TLP108(F) by Toshiba America Electronic Components

Results Overview of TLP108(F) by Toshiba America Electronic Components

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Applications Education and Research Aerospace and Defense Agriculture Technology Robotics and Drones

TLP108(F) Information

TLP108(F) by Toshiba America Electronic Components is an Optocoupler.
Optocoupler are under the broader part category of Optoelectronics.

Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.

Price & Stock for TLP108(F)

Part # Distributor Description Stock Price Buy
DISTI # 68461185
Verical Optocoupler Logic-Out Totem-Pole DC-IN 1-CH 5-Pin MFSOP Magazine RoHS: Compliant Min Qty: 34 Package Multiple: 1 Date Code: 2201 Americas - 260
  • 34 $2.2652
  • 50 $2.1789
  • 100 $2.1050
  • 250 $2.0411
$2.0411 / $2.2652 Buy Now
Quest Components IC OUTPUT OPTOCOUPLER, 1-ELEMENT, 3750V ISOLATION 208
  • 1 $4.2150
  • 25 $2.8100
  • 90 $2.5993
$2.5993 / $4.2150 Buy Now

Part Details for TLP108(F)

TLP108(F) CAD Models

TLP108(F) Part Data Attributes

TLP108(F) Toshiba America Electronic Components
Buy Now Datasheet
Compare Parts:
TLP108(F) Toshiba America Electronic Components IC PHOTOCOUPLER IRED 6-MFSOP
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Reach Compliance Code unknown
Samacsys Manufacturer Toshiba
Forward Current-Max 0.01 A
Isolation Voltage-Max 3750 V
Mounting Feature SURFACE MOUNT
Number of Elements 1
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Response Time-Nom 2.5e-7 ns
Supply Voltage-Nom 20 V
Surface Mount YES

TLP108(F) Related Parts

TLP108(F) Frequently Asked Questions (FAQ)

  • A good PCB layout for the TLP108(F) involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 10uF capacitor between the VIN and GND pins to filter out noise.

  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to dissipate heat efficiently, and thermal interface material (TIM) can be used to improve heat transfer between the device and heat sink.

  • To prevent damage, it's essential to handle the TLP108(F) by the body, avoiding touching the pins or leads. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the leads, as this can cause mechanical stress and damage to the device.

  • Yes, the TLP108(F) is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified, which means it meets the stringent requirements for automotive applications. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates reliably in these applications.

  • To troubleshoot issues with the TLP108(F), start by verifying the input voltage and current, and checking for proper PCB layout and thermal management. Use an oscilloscope to monitor the output voltage and current, and check for signs of overheating or electrical overstress. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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