Part Details for TLE8444SL by Infineon Technologies AG
Results Overview of TLE8444SL by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Automotive
Robotics and Drones
TLE8444SL Information
TLE8444SL by Infineon Technologies AG is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for TLE8444SL
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
726-TLE8444SL
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Mouser Electronics | Gate Drivers Quad Half-Bridge Driver RoHS: Compliant | 700 |
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$1.8700 / $5.0400 | Buy Now |
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ComSIT USA | QUAD HALF-BRIDGE DRIVER IC Half Bridge Based Peripheral Driver, 2.4A, PDSO24 ECCN: EAR99 RoHS: Compliant |
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RFQ | |
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Win Source Electronics | Quad Half-Bridge Driver IC | 19785 |
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$4.2296 / $6.3444 | Buy Now |
Part Details for TLE8444SL
TLE8444SL CAD Models
TLE8444SL Part Data Attributes
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TLE8444SL
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
TLE8444SL
Infineon Technologies AG
Half Bridge Based Peripheral Driver, 2.4A, PDSO24, GREEN, PLASTIC, MO-137AE, SSOP-24
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | SSOP | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Infineon | |
| Interface IC Type | HALF BRIDGE BASED PERIPHERAL DRIVER | |
| JESD-30 Code | R-PDSO-G24 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 24 | |
| Output Current Flow Direction | SOURCE AND SINK | |
| Output Peak Current Limit-Nom | 2.4 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
TLE8444SL Frequently Asked Questions (FAQ)
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A good PCB layout for the TLE8444SL involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the battery. Additionally, using a common mode choke and a shielded cable can help reduce EMI.
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To ensure proper cooling, make sure to provide a sufficient heat sink, use a thermal interface material, and ensure good airflow around the device. The TLE8444SL has a thermal pad on the bottom, so a heat sink attached to the pad can help dissipate heat.
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Exceeding the maximum junction temperature of the TLE8444SL can lead to reduced lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.
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Yes, the TLE8444SL is designed to withstand high vibrations. However, it's essential to ensure the device is properly mounted and secured to the PCB to prevent damage or detachment. Additionally, using a vibration-resistant PCB material and a robust soldering process can help ensure reliability.
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To troubleshoot issues with the TLE8444SL, start by checking the input voltage, current, and temperature. Verify that the device is properly cooled and that the PCB layout is correct. Use an oscilloscope to monitor the device's behavior and identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.