Datasheets
TLE6250GXT by: Infineon Technologies AG

Interface Circuit, BICMOS, PDSO8, GREEN, PLASTIC, SOP-8

Part Details for TLE6250GXT by Infineon Technologies AG

Results Overview of TLE6250GXT by Infineon Technologies AG

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

TLE6250GXT Information

TLE6250GXT by Infineon Technologies AG is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for TLE6250GXT

Part # Distributor Description Stock Price Buy
Vyrian Telecommunications 580
RFQ

Part Details for TLE6250GXT

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TLE6250GXT Part Data Attributes

TLE6250GXT Infineon Technologies AG
Buy Now Datasheet
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TLE6250GXT Infineon Technologies AG Interface Circuit, BICMOS, PDSO8, GREEN, PLASTIC, SOP-8
Rohs Code Yes
Part Life Cycle Code End Of Life
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description SOP,
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 53 Weeks, 1 Day
JESD-30 Code R-PDSO-G8
Length 5 mm
Number of Functions 1
Number of Terminals 8
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.75 mm
Supply Voltage-Nom 5 V
Surface Mount YES
Technology BICMOS
Telecom IC Type CAN TRANSCEIVER
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4 mm

Alternate Parts for TLE6250GXT

This table gives cross-reference parts and alternative options found for TLE6250GXT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TLE6250GXT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
935261511005 NXP Semiconductors Check for Price IC DATACOM, INTERFACE CIRCUIT, UUC15, DIE-15, Network Interface TLE6250GXT vs 935261511005
PI2C3000AV Pericom Semiconductor Corporation Check for Price Interface Circuit, BICMOS, PDSO48, 0.300 INCH, PLASTIC, SSOP-48 TLE6250GXT vs PI2C3000AV
TJA1054T/S900,118 NXP Semiconductors Check for Price TJA1054 - Fault-tolerant CAN transceiver SOIC 14-Pin TLE6250GXT vs TJA1054T/S900,118
SP000938316 Infineon Technologies AG Check for Price Interface Circuit, TLE6250GXT vs SP000938316
TJA1041AU,027 NXP Semiconductors Check for Price TJA1041A - High-speed CAN transceiver with standby and sleep mode TLE6250GXT vs TJA1041AU,027
HI-5115112PSIF Holt Integrated Circuits Inc Check for Price LINE TRANSCEIVER, PDSO18, ROHS COMPLIANT, PLASTIC, WSOIC-18 TLE6250GXT vs HI-5115112PSIF
TJA1080TS/N,118 NXP Semiconductors Check for Price TJA1080 - FlexRay transceiver SSOP2 20-Pin TLE6250GXT vs TJA1080TS/N,118
TJA1054T/N1,112 NXP Semiconductors Check for Price TJA1054 - Fault-tolerant CAN transceiver SOIC 14-Pin TLE6250GXT vs TJA1054T/N1,112
TJA1050T/S400,118 NXP Semiconductors Check for Price TJA1050 - High-speed CAN transceiver SOIC 8-Pin TLE6250GXT vs TJA1050T/S400,118
TJA1054T/S900M,512 NXP Semiconductors Check for Price TJA1054T TLE6250GXT vs TJA1054T/S900M,512

TLE6250GXT Frequently Asked Questions (FAQ)

  • A good PCB layout for the TLE6250GXT involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a shielded cable for the output stage and to keep the sensitive analog circuitry away from the high-power switching components.

  • To ensure proper cooling, make sure to provide a sufficient heat sink and thermal interface material between the device and the heat sink. The heat sink should be designed to dissipate the maximum power loss of the device, which can be calculated using the datasheet specifications. Additionally, ensure good airflow around the heat sink to prevent overheating.

  • The critical timing parameters for the TLE6250GXT include the dead time, minimum on-time, and maximum off-time. To ensure these parameters are met, carefully design the gate drive circuitry and adjust the timing resistors and capacitors according to the datasheet recommendations. Additionally, consider using a dedicated gate driver IC to ensure precise control over the switching times.

  • To protect the TLE6250GXT from overvoltage and undervoltage conditions, use a voltage supervisor or a power-on reset circuit to monitor the supply voltage and reset the device if it falls outside the recommended operating range. Additionally, consider using a voltage clamp or a transient voltage suppressor to protect the device from voltage spikes and surges.

  • When handling the TLE6250GXT, it's essential to follow proper ESD protection procedures to prevent damage to the device. This includes using an ESD wrist strap or mat, storing the device in an anti-static bag or container, and avoiding touching the device's pins or exposed internal components.

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