-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
LED Driver
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TLD2314EL by Infineon Technologies AG is a Display Driver.
Display Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
726-TLD2314EL
|
Mouser Electronics | LED Lighting Driver ICs LITIX RoHS: Compliant | 1869 |
|
$0.4340 / $1.6500 | Buy Now |
DISTI #
SMC-TLD2314EL
|
Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 13530 |
|
RFQ | |
|
LCSC | PWM 3 SSOP-14-EP-150mil LED Drivers ROHS | 2239 |
|
$0.7891 / $1.0079 | Buy Now |
|
Win Source Electronics | 3 Channel High Side Current Source | 37500 |
|
$0.5429 / $0.7011 | Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
TLD2314EL
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
TLD2314EL
Infineon Technologies AG
LED Driver
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Infineon | |
Interface IC Type | LED DISPLAY DRIVER | |
JESD-30 Code | R-PDSO-G14 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Segments | 9 | |
Number of Terminals | 14 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HLSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max | 40 V | |
Supply Voltage-Min | 5.5 V | |
Supply Voltage-Nom | 13.5 V | |
Surface Mount | YES | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 3.9 mm |
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 mm clearance around the device for airflow and heat dissipation.
Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans. Ensure the device is operated within the specified temperature range (-40°C to 150°C) and consider derating the device for high-temperature applications.
Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering, as they can cause damage to the device.
Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress during shipping and storage.
Handle the devices in an ESD-protected environment, using wrist straps, mats, or other ESD protection devices. Ensure that all equipment and tools are grounded and ESD-safe.