Part Details for TLC272CPP1 by Texas Instruments
Results Overview of TLC272CPP1 by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Education and Research
Internet of Things (IoT)
Audio and Video Systems
Smart Cities
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
TLC272CPP1 Information
TLC272CPP1 by Texas Instruments is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Price & Stock for TLC272CPP1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 640 |
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RFQ |
Part Details for TLC272CPP1
TLC272CPP1 CAD Models
TLC272CPP1 Part Data Attributes
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TLC272CPP1
Texas Instruments
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Datasheet
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TLC272CPP1
Texas Instruments
IC,OP-AMP,DUAL,CMOS,DIP,8PIN,PLASTIC
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP8,.3 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Average Bias Current-Max (IIB) | 0.035 µA | |
| Common-mode Reject Ratio-Min | 60 dB | |
| Common-mode Reject Ratio-Nom | 86 dB | |
| Frequency Compensation | YES | |
| Input Offset Voltage-Max | 12000 µV | |
| JESD-30 Code | R-PDIP-T8 | |
| Low-Bias | YES | |
| Low-Offset | NO | |
| Micropower | NO | |
| Number of Functions | 2 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power | NO | |
| Programmable Power | NO | |
| Qualification Status | Not Qualified | |
| Slew Rate-Nom | 2.5 V/us | |
| Supply Current-Max | 2.2 mA | |
| Supply Voltage-Nom (Vsup) | 10 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Unity Gain BW-Nom | 1600 | |
| Voltage Gain-Min | 3500 | |
| Wideband | NO |