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Power MOSFET - Nch 60V<VDSS≤150V
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TK72E12N1,S1X by Toshiba America Electronic Components is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TK72E12N1S1X-ND
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DigiKey | MOSFET N CH 120V 72A TO-220 Min Qty: 1 Lead time: 16 Weeks Container: Tube |
96 In Stock |
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$1.2725 / $3.2200 | Buy Now |
DISTI #
TK72E12N1,S1X
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Avnet Americas | Power MOSFET, N Channel, 120 V, 72 A, 4.4 Milliohms, TO-220, 3 Pins, Through Hole - Rail/Tube (Alt: TK72E12N1,S1X) RoHS: Compliant Min Qty: 50 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tube | 140 |
|
RFQ | |
DISTI #
757-TK72E12N1S1X
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Mouser Electronics | MOSFETs N-Ch 120V 179A 225W UMOSVIII 130nC .0044 RoHS: Compliant | 392 |
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$1.2700 / $2.9000 | Buy Now |
DISTI #
V36:1790_13896191
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Arrow Electronics | Trans MOSFET N-CH Si 120V 179A 3-Pin(3+Tab) TO-220 Magazine RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 16 Weeks Date Code: 2412 | Americas - 19250 |
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$1.1890 / $1.5080 | Buy Now |
DISTI #
79372420
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Verical | Trans MOSFET N-CH Si 120V 179A 3-Pin(3+Tab) TO-220 Magazine RoHS: Compliant Min Qty: 50 Package Multiple: 50 Date Code: 2412 | Americas - 19250 |
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$1.1890 | Buy Now |
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Vyrian | Transistors | 9891 |
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RFQ |
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TK72E12N1,S1X
Toshiba America Electronic Components
Buy Now
Datasheet
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Compare Parts:
TK72E12N1,S1X
Toshiba America Electronic Components
Power MOSFET - Nch 60V<VDSS≤150V
|
Part Life Cycle Code | Active | |
Ihs Manufacturer | TOSHIBA CORP | |
Reach Compliance Code | unknown | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | Toshiba |
A recommended PCB layout for optimal thermal performance would be to have a large copper area on the top and bottom layers connected to the thermal pad, and to use thermal vias to dissipate heat. Additionally, keeping the PCB layers as thin as possible and using a thermal interface material can also help.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device. Avoid applying excessive force or pressure, which can damage the device.
When handling the device, take precautions to prevent electrostatic discharge (ESD) by wearing an ESD wrist strap or using an ESD mat. Avoid touching the device's pins or exposed internal components, and handle the device by the package body only.
To determine a suitable heat sink, consider the device's power dissipation, ambient temperature, and airflow. A heat sink with a thermal resistance of 10°C/W or lower is recommended. The heat sink should also be designed to fit the device's package and have a suitable attachment method.
The TK72E12N1,S1X meets the reliability and quality standards of the Automotive Electronics Council (AEC) and the International Electrotechnical Commission (IEC). It is also compliant with the Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives.