Part Details for TIP145 by Central Semiconductor Corp
Results Overview of TIP145 by Central Semiconductor Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TIP145 Information
TIP145 by Central Semiconductor Corp is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for TIP145
TIP145 CAD Models
TIP145 Part Data Attributes
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TIP145
Central Semiconductor Corp
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Datasheet
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TIP145
Central Semiconductor Corp
Power Bipolar Transistor, 10A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon, TO-218, Plastic/Epoxy, 3 Pin,
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CENTRAL SEMICONDUCTOR CORP | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | Central Semiconductor | |
| Case Connection | COLLECTOR | |
| Collector Current-Max (IC) | 10 A | |
| Collector-Emitter Voltage-Max | 60 V | |
| Configuration | DARLINGTON | |
| DC Current Gain-Min (hFE) | 500 | |
| JEDEC-95 Code | TO-218 | |
| JESD-30 Code | R-PSFM-T3 | |
| JESD-609 Code | e0 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | PNP | |
| Power Dissipation-Max (Abs) | 125 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | SINGLE | |
| Transistor Application | AMPLIFIER | |
| Transistor Element Material | SILICON |
Alternate Parts for TIP145
This table gives cross-reference parts and alternative options found for TIP145. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TIP145, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| TIP146 | Rochester Electronics LLC | Check for Price | 10A, 80V, PNP, Si, POWER TRANSISTOR, TO-218, CASE 340D-02, 3 PIN | TIP145 vs TIP146 |
| TIP145 | JW Miller | Check for Price | POWER TRANSISTOR, PLASTIC, FM-3 | TIP145 vs TIP145 |
| TIP146 | Motorola Mobility LLC | Check for Price | 10A, 80V, PNP, Si, POWER TRANSISTOR, TO-218 | TIP145 vs TIP146 |
| TIP145 | Motorola Mobility LLC | Check for Price | 10A, 60V, PNP, Si, POWER TRANSISTOR, TO-218 | TIP145 vs TIP145 |
| TIP145 | STMicroelectronics | Check for Price | 10A, 60V, PNP, Si, POWER TRANSISTOR, TO-247, ROHS COMPLIANT, PLASTIC PACKAGE-3 | TIP145 vs TIP145 |
TIP145 Frequently Asked Questions (FAQ)
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The maximum safe operating area (SOA) for the TIP145 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general rule, it's recommended to operate the device within the specified maximum ratings and avoid operating conditions that may cause excessive heat or electrical stress.
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To ensure reliable operation of the TIP145 in high-temperature environments, it's essential to provide adequate heat sinking and ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials, such as thermal paste or thermal tape, to improve heat transfer between the device and the heat sink.
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The recommended PCB layout and thermal design for the TIP145 involve using a thermally efficient layout, such as a star configuration, to minimize thermal resistance. Ensure that the device is placed near a heat sink or thermal pad, and use thermal vias to dissipate heat effectively. Consult the manufacturer's application notes and thermal design guidelines for more specific recommendations.
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Yes, the TIP145 can be used in switching applications, but it's essential to consider the device's switching characteristics, such as turn-on and turn-off times, and ensure that the device is operated within its specified frequency range. Additionally, consider the impact of switching losses on the device's thermal performance and ensure that the device is properly heat-sinked.
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To protect the TIP145 from electrical overstress (EOS) and electrostatic discharge (ESD), use proper handling and storage procedures, such as using anti-static bags and wrist straps. Ensure that the device is operated within its specified voltage and current ratings, and consider using protective devices, such as TVS diodes or zener diodes, to clamp voltage transients.