Part Details for TFA9879HN/N1,157 by NXP Semiconductors
Results Overview of TFA9879HN/N1,157 by NXP Semiconductors
- Distributor Offerings: (12 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for TFA9879HN/N1,157
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2841030
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Farnell | AUDIO POWER AMPLIFIER, CLASS D, HVQFN-24 RoHS: Compliant Min Qty: 1 Lead time: 17 Weeks, 0 Days Container: Each | 394 |
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$1.2109 / $2.2597 | Buy Now |
DISTI #
568-7564-ND
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DigiKey | IC AMP CLSS D MONO 2.75W 24HVQFN Min Qty: 1 Lead time: 17 Weeks Container: Tray |
2797 In Stock |
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$1.1189 / $2.2400 | Buy Now |
DISTI #
TFA9879HN/N1,157
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Avnet Americas | Audio Amp Speaker 1-CH Mono 2.75W Class-D 24-Pin HVQFN EP Tray - Trays (Alt: TFA9879HN/N1,157) RoHS: Compliant Min Qty: 2450 Package Multiple: 2450 Lead time: 17 Weeks, 0 Days Container: Tray | 0 |
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$0.9851 / $1.0185 | Buy Now |
DISTI #
771-TFA9879HNN1157
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Mouser Electronics | Audio Amplifiers ClassD 2.75W 2Channel 1.8V 5.7mA RoHS: Compliant | 689 |
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$1.1300 / $2.1100 | Buy Now |
DISTI #
V99:2348_06547149
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Arrow Electronics | Audio Amp Speaker 1-CH Mono 2.75W Class-D 24-Pin HVQFN EP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 17 Weeks Date Code: 2218 | Americas - 80 |
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$1.0596 / $1.5463 | Buy Now |
DISTI #
76890025
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Verical | Audio Amp Speaker 1-CH Mono 2.75W Class-D 24-Pin HVQFN EP Tray RoHS: Compliant Min Qty: 6 Package Multiple: 1 Date Code: 2218 | Americas - 80 |
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$1.0596 / $1.0974 | Buy Now |
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Bristol Electronics | 101 |
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RFQ | ||
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NXP Semiconductors | TFA9879HN, Mono BTL Class D Audio Amplifier for Portable Applications with Digital Input, Tray, Bakeable, Multiple RoHS: Compliant pbFree: Yes Lead time: 17 Weeks, 0 Days Container: Tray | Free Sample - 2450 |
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$0.9900 | Buy Now |
DISTI #
TFA9879HN/N1,157
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Avnet Silica | Audio Amp Speaker 1CH Mono 275W ClassD 24Pin HVQFN EP Tray (Alt: TFA9879HN/N1,157) RoHS: Compliant Min Qty: 2450 Package Multiple: 2450 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
TFA9879HN/N1,157
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Avnet Silica | Audio Amp Speaker 1CH Mono 275W ClassD 24Pin HVQFN EP Tray (Alt: TFA9879HN/N1,157) RoHS: Compliant Min Qty: 2450 Package Multiple: 2450 Lead time: 18 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for TFA9879HN/N1,157
TFA9879HN/N1,157 CAD Models
TFA9879HN/N1,157 Part Data Attributes
|
TFA9879HN/N1,157
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
TFA9879HN/N1,157
NXP Semiconductors
TFA9879 - Mono BTL Class D audio amplifier for portable applications with digital input QFN 24-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | HVQFN-24 | |
Pin Count | 24 | |
Manufacturer Package Code | SOT616-3 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 17 Weeks | |
Samacsys Manufacturer | NXP | |
Consumer IC Type | CLASS D AUDIO AMPLIFIER | |
JESD-30 Code | S-PQCC-N24 | |
Length | 4 mm | |
Moisture Sensitivity Level | 1 | |
Number of Channels | 1 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
Output Power-Nom | 2.75 W | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC24,.16SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1 mm | |
Supply Current-Max | 0.02 mA | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 4 mm |
TFA9879HN/N1,157 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate, and use a common ground point for the device. Ensure good thermal conductivity by using thermal vias and a heat sink.
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Use a 2nd-order LC filter with a cutoff frequency of around 100 kHz to 200 kHz. Choose inductors with low ESR and high Q-factor. Ensure the filter components are placed close to the device to minimize parasitic inductance and capacitance.
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Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure a stable voltage supply before applying the clock signal. A soft-start circuit can be used to prevent inrush currents during power-up.
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Use a shielded enclosure, and ensure good grounding and decoupling. Keep the device and its components away from the PCB edges. Use a common-mode choke or a ferrite bead to filter the output. Implement a spread-spectrum clocking technique to reduce EMI.
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The maximum allowed power dissipation is around 2.5 W. Ensure good thermal design and heat sinking to keep the junction temperature below 150°C. Use a thermal interface material and a heat sink with a thermal resistance of around 10°C/W.