Part Details for TE28F128J3D75A by Micron Technology Inc
Results Overview of TE28F128J3D75A by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TE28F128J3D75A Information
TE28F128J3D75A by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for TE28F128J3D75A
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TE28F128J3D75A
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Avnet Silica | NOR Flash Parallel 3V33V 128Mbit 16M8M x 8bit16bit 75ns 56Pin TSOP Tray (Alt: TE28F128J3D75A) RoHS: Not Compliant Min Qty: 576 Package Multiple: 576 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Vyrian | Memory ICs | 1462 |
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RFQ |
Part Details for TE28F128J3D75A
TE28F128J3D75A CAD Models
TE28F128J3D75A Part Data Attributes
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TE28F128J3D75A
Micron Technology Inc
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Datasheet
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TE28F128J3D75A
Micron Technology Inc
Flash, 8MX16, 75ns, PDSO56
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Micron | |
Access Time-Max | 75 ns | |
Alternate Memory Width | 8 | |
Command User Interface | YES | |
Common Flash Interface | YES | |
Data Polling | NO | |
JESD-30 Code | R-PDSO-G56 | |
Memory Density | 134217728 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Number of Sectors/Size | 128 | |
Number of Terminals | 56 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP56,.8,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Page Size | 4/8 words | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 235 | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Sector Size | 128K | |
Standby Current-Max | 0.00012 A | |
Supply Current-Max | 0.08 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Toggle Bit | NO | |
Type | NOR TYPE |
TE28F128J3D75A Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the TE28F128J3D75A is -40°C to 85°C.
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The hold signal (HOLD#) should be asserted low to pause the current operation and de-asserted high to resume the operation.
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The recommended power-up sequence is to apply VCC first, followed by VPP, and then the clock signal.
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The device density and architecture can be determined by reading the device ID and manufacturer ID through the JEDEC ID command (0x90).
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The write protect (WP#) signal is used to prevent accidental writes to the device. When WP# is asserted low, the device is write-protected.