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TDA8950 - 2 x 150 W class-D power amplifier ZIP 23-Pin
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9827
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Newark | 2 X 150 W Class-D Power Amplifier/ Tube Rohs Compliant: Yes |Nxp TDA8950J/N1,112 RoHS: Compliant Min Qty: 432 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$5.4400 / $5.6000 | Buy Now |
DISTI #
TDA8950J/N1,112
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Avnet Silica | Audio Amp Speaker 1CH Mono2CH Stereo 340W ClassD 23Pin DBS23P Tube (Alt: TDA8950J/N1,112) RoHS: Compliant Min Qty: 18 Package Multiple: 18 | Silica - 0 |
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Buy Now | |
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Cytech Systems Limited | IC AMP D MONO/STEREO 340W DBS23P | 2000 |
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RFQ | |
DISTI #
TDA8950J/N1,112
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EBV Elektronik | Audio Amp Speaker 1CH Mono2CH Stereo 340W ClassD 23Pin DBS23P Tube (Alt: TDA8950J/N1,112) RoHS: Compliant Min Qty: 18 Package Multiple: 18 | EBV - 0 |
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Buy Now | |
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Vyrian | General Purpose ICs | 1523 |
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RFQ |
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TDA8950J/N1,112
NXP Semiconductors
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Datasheet
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TDA8950J/N1,112
NXP Semiconductors
TDA8950 - 2 x 150 W class-D power amplifier ZIP 23-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | ZIP | |
Package Description | PLASTIC, SOT411-1, DIL-BENT-SIL, 23 PIN | |
Pin Count | 23 | |
Manufacturer Package Code | SOT411-1 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.33.00.01 | |
Samacsys Manufacturer | NXP | |
Bandwidth-Nom | 20 kHz | |
Consumer IC Type | CLASS D AUDIO AMPLIFIER | |
Gain | 30 dB | |
Harmonic Distortion | 0.05% | |
JESD-30 Code | R-PZIP-T23 | |
JESD-609 Code | e3 | |
Number of Channels | 2 | |
Number of Functions | 1 | |
Number of Terminals | 23 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Power-Nom | 170 W | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | ZIP | |
Package Equivalence Code | ZIP23,.2,.17 | |
Package Shape | RECTANGULAR | |
Package Style | FLANGE MOUNT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Supply Current-Max | 75 mA | |
Supply Voltage-Max (Vsup) | 40 V | |
Supply Voltage-Min (Vsup) | 12.5 V | |
Surface Mount | NO | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin (Sn) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 1.27 mm | |
Terminal Position | ZIG-ZAG | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
A good thermal design should be used to ensure the device operates within the recommended temperature range. A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a metal plate to dissipate heat efficiently.
To ensure stability, a compensation network consisting of resistors and capacitors should be added between the output and the negative input. The values of these components depend on the specific application and can be calculated using the datasheet's stability analysis guidelines.
A decoupling capacitor of at least 10uF should be placed close to the device's power pins (VCC and GND) to filter out high-frequency noise and ensure stable operation. Additional decoupling capacitors can be added at the input and output stages for further noise reduction.
TVS (Transient Voltage Suppressor) diodes or ESD protection devices can be added to the input and output stages to protect the amplifier from overvoltage and ESD events. Additionally, a fuse or a PTC (Positive Temperature Coefficient) thermistor can be used to protect the device from overcurrent conditions.
The mute pin should be asserted at least 10ms before the amplifier is powered down to prevent audible clicks or pops. The recommended mute sequence is: assert mute, wait 10ms, power down the amplifier, and then remove the input signal.