Part Details for TC58FVM6B5BTG65 by Toshiba America Electronic Components
Results Overview of TC58FVM6B5BTG65 by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TC58FVM6B5BTG65 Information
TC58FVM6B5BTG65 by Toshiba America Electronic Components is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for TC58FVM6B5BTG65
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ComSIT USA | 64M (4M X 16 BITS) CMOS FLASH MEMORY Flash, 4MX16, 65ns, PDSO48 ECCN: EAR99 RoHS: Compliant |
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Part Details for TC58FVM6B5BTG65
TC58FVM6B5BTG65 CAD Models
TC58FVM6B5BTG65 Part Data Attributes
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TC58FVM6B5BTG65
Toshiba America Electronic Components
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Datasheet
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TC58FVM6B5BTG65
Toshiba America Electronic Components
IC 4M X 16 FLASH 3V PROM, 65 ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48, Programmable ROM
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | TSOP1 | |
| Package Description | 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 65 ns | |
| Boot Block | BOTTOM | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PDSO-G48 | |
| Length | 18.4 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 8,127 | |
| Number of Terminals | 48 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Equivalence Code | TSSOP48,.8,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Page Size | 8 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.2 mm | |
| Sector Size | 4K,32K | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.07 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 12 mm |
TC58FVM6B5BTG65 Frequently Asked Questions (FAQ)
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Toshiba provides a recommended PCB layout in their application note (TAEC-AN-001) for the TC58FVM6B5BTG65. It includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and reliability.
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The TC58FVM6B5BTG65 has an internal POR and BOR circuitry. To handle these, ensure a stable power supply, use a capacitor to filter the power supply voltage, and add a reset circuit to the system design. Toshiba's application note (TAEC-AN-002) provides more details on implementing a robust reset circuit.
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Although the datasheet specifies an operating temperature range of -40°C to 85°C, Toshiba recommends derating the device's performance at extreme temperatures. For reliable operation, it's essential to follow the thermal management guidelines in the datasheet and application notes.
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To prevent data corruption, use the device's built-in power-down and power-up sequence controls. Ensure that the power supply is stable before accessing the device, and use the 'Ready/Busy' signal to monitor the device's status. Additionally, implement a robust power-down sequence to prevent data corruption.
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Toshiba provides recommended timing parameters in the datasheet and application notes. For optimal performance, follow the recommended clock frequency and latency settings, and adjust them according to your specific system requirements.