Part Details for TC55VEM208ASTN55 by Toshiba America Electronic Components
Results Overview of TC55VEM208ASTN55 by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TC55VEM208ASTN55 Information
TC55VEM208ASTN55 by Toshiba America Electronic Components is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for TC55VEM208ASTN55
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | 524,288-WORD BY 8-BIT STATIC RAM Standard SRAM, 512KX8, 70ns, CMOS, PDSO32 ECCN: 3A991.B.2.A RoHS: Not Compliant |
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RFQ |
Part Details for TC55VEM208ASTN55
TC55VEM208ASTN55 CAD Models
TC55VEM208ASTN55 Part Data Attributes
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TC55VEM208ASTN55
Toshiba America Electronic Components
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Datasheet
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TC55VEM208ASTN55
Toshiba America Electronic Components
IC 512K X 8 STANDARD SRAM, 70 ns, PDSO32, 0.50 MM PITCH, PLASTIC, TSOP1-32, Static RAM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | TSOP1 | |
| Package Description | 0.50 MM PITCH, PLASTIC, TSOP1-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e0 | |
| Length | 11.8 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |
Alternate Parts for TC55VEM208ASTN55
This table gives cross-reference parts and alternative options found for TC55VEM208ASTN55. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC55VEM208ASTN55, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 5962-9561317HTX | Microsemi Corporation | Check for Price | Standard SRAM, 512KX8, 85ns, CMOS, CDSO32, CERAMIC, SOJ-32 | TC55VEM208ASTN55 vs 5962-9561317HTX |
| DPS512S8P-12C | B&B Electronics Manufacturing Company | Check for Price | SRAM Module, 512KX8, 120ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | TC55VEM208ASTN55 vs DPS512S8P-12C |
| WMS512K8L-20CC | Microsemi Corporation | Check for Price | Standard SRAM, 512KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | TC55VEM208ASTN55 vs WMS512K8L-20CC |
| UT7Q512K8-UPX | Cobham Semiconductor Solutions | Check for Price | Standard SRAM, 512KX8, 100ns, CMOS, CDFP32, BOTTOM BRAZED, CERAMIC, FP-32 | TC55VEM208ASTN55 vs UT7Q512K8-UPX |
| 5962-9561315HTX | Microsemi Corporation | Check for Price | Standard SRAM, 512KX8, 120ns, CMOS, CDSO32, CERAMIC, SOJ-32 | TC55VEM208ASTN55 vs 5962-9561315HTX |
| MS8512FKLI-25 | Mosaic Semiconductor Inc | Check for Price | SRAM Module, 512KX8, 25ns, CMOS | TC55VEM208ASTN55 vs MS8512FKLI-25 |
| WMS512K8-L35DEQ | Microsemi Corporation | Check for Price | 512KX8 STANDARD SRAM, 35ns, CDSO32, CREAMIC, SOJ-32 | TC55VEM208ASTN55 vs WMS512K8-L35DEQ |
| WMS512K8L-15CLM | Microsemi Corporation | Check for Price | Standard SRAM, 512KX8, 15ns, CMOS, CQCC32, BRAZED, CERAMIC, LCC-32 | TC55VEM208ASTN55 vs WMS512K8L-15CLM |
| WMS512K8-20FFMA | Microsemi Corporation | Check for Price | Standard SRAM, 512KX8, 20ns, CMOS, CDFP32, CERAMIC, DFP-32 | TC55VEM208ASTN55 vs WMS512K8-20FFMA |
| WMS512K8L-55CC | Microsemi Corporation | Check for Price | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | TC55VEM208ASTN55 vs WMS512K8L-55CC |