Part Details for TC55RP3302EMB713 by Microchip Technology Inc
Results Overview of TC55RP3302EMB713 by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TC55RP3302EMB713 Information
TC55RP3302EMB713 by Microchip Technology Inc is a Linear Regulator IC.
Linear Regulator ICs are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for TC55RP3302EMB713
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | FIXED POSITIVE LDO REGULATOR, 3.3V, 0.7V DROPOUT, CMOS, PSSO3 | 640 |
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$2.8875 / $5.2500 | Buy Now |
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Quest Components | FIXED POSITIVE LDO REGULATOR, 3.3V, 0.7V DROPOUT, CMOS, PSSO3 | 295 |
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$2.1000 / $5.2500 | Buy Now |
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Quest Components | FIXED POSITIVE LDO REGULATOR, 3.3V, 0.7V DROPOUT, CMOS, PSSO3 | 220 |
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$0.9800 / $2.8000 | Buy Now |
Part Details for TC55RP3302EMB713
TC55RP3302EMB713 CAD Models
TC55RP3302EMB713 Part Data Attributes
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TC55RP3302EMB713
Microchip Technology Inc
Buy Now
Datasheet
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TC55RP3302EMB713
Microchip Technology Inc
3.3 V FIXED POSITIVE LDO REGULATOR, PSSO3, SOT-89, 3 PIN
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Part Package Code | SOT-89 | |
Package Description | , TO-243 | |
Pin Count | 3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Microchip | |
Adjustability | FIXED | |
Dropout Voltage1-Max | 0.7 V | |
Dropout Voltage1-Nom | 0.4 V | |
Input Voltage Absolute-Max | 12 V | |
Input Voltage-Max | 10 V | |
Input Voltage-Min | 4.3 V | |
JESD-30 Code | R-PSSO-F3 | |
JESD-609 Code | e0 | |
Length | 4.5 mm | |
Line Regulation-Max | 0.05643% | |
Load Regulation-Max | 0.09% | |
Number of Functions | 1 | |
Number of Outputs | 1 | |
Number of Terminals | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Current1-Max | 0.15 A | |
Output Voltage1-Max | 3.366 V | |
Output Voltage1-Min | 3.234 V | |
Output Voltage1-Nom | 3.3 V | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOF | |
Package Equivalence Code | TO-243 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Packing Method | TR | |
Qualification Status | Not Qualified | |
Regulator Type | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR | |
Seated Height-Max | 1.6 mm | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN LEAD | |
Terminal Form | FLAT | |
Terminal Pitch | 1.5 mm | |
Terminal Position | SINGLE | |
Voltage Tolerance-Max | 2.12% | |
Width | 2.445 mm |
TC55RP3302EMB713 Frequently Asked Questions (FAQ)
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Microchip recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
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To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, and to consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
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Microchip recommends following the JEDEC J-STD-020D.1 standard for soldering conditions, with a peak temperature of 260°C (500°F) and a dwell time of 30 seconds maximum.
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The TC55RP3302EMB713 is a surface-mount device, and as such, it's susceptible to vibration-induced solder joint fatigue. To ensure reliability in high-vibration environments, it's recommended to use a robust soldering process and consider additional mechanical support or potting compounds.
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The TC55RP3302EMB713 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing, such as using ESD-safe workstations, wrist straps, and packaging materials.