Part Details for TC1275-5ENBTR by Microchip Technology Inc
Results Overview of TC1275-5ENBTR by Microchip Technology Inc
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
TC1275-5ENBTR Information
TC1275-5ENBTR by Microchip Technology Inc is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Part Details for TC1275-5ENBTR
TC1275-5ENBTR CAD Models
TC1275-5ENBTR Part Data Attributes
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TC1275-5ENBTR
Microchip Technology Inc
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Datasheet
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TC1275-5ENBTR
Microchip Technology Inc
1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3, SOT-23B, 3 PIN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | SOT-23 | |
| Package Description | PLASTIC, SOT-23, 3 PIN | |
| Pin Count | 3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Adjustable Threshold | NO | |
| Analog IC - Other Type | VOLTAGE SUPERVISOR/RESET IC | |
| JESD-30 Code | R-PDSO-G3 | |
| JESD-609 Code | e3 | |
| Length | 2.9 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Channels | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TO-236 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.12 mm | |
| Supply Current-Max (Isup) | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.2 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.95 mm | |
| Terminal Position | DUAL | |
| Threshold Voltage-Nom | +3.06V | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 1.97 mm |
TC1275-5ENBTR Frequently Asked Questions (FAQ)
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A good PCB layout for the TC1275-5ENBTR should include a solid ground plane, wide power traces, and minimal thermal resistance between the device and the heat sink. A 4-layer PCB with a dedicated thermal layer is recommended.
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To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Additionally, consider using a thermal interface material with a high thermal conductivity coefficient.
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Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure proper heat sinking and thermal management to maintain a safe operating temperature.
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Yes, the TC1275-5ENBTR is suitable for high-reliability and safety-critical applications. However, it's essential to follow Microchip's guidelines for reliability and to perform thorough testing and validation to ensure the device meets the specific application requirements.
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To troubleshoot issues with the TC1275-5ENBTR, start by verifying the power supply voltage, checking for proper heat sinking, and ensuring correct PCB layout. Use oscilloscopes and thermal imaging tools to identify potential issues. Consult Microchip's application notes and technical support resources for further guidance.