Datasheets
TBD62003AFWG by: Toshiba America Electronic Components

Interface Driver, Transistor Array

Part Details for TBD62003AFWG by Toshiba America Electronic Components

Results Overview of TBD62003AFWG by Toshiba America Electronic Components

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TBD62003AFWG Information

TBD62003AFWG by Toshiba America Electronic Components is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for TBD62003AFWG

Part # Distributor Description Stock Price Buy
DISTI # TBD62003AFWG
TME IC: driver, transistor array, PSOP16, 0.5A, 2÷50V, Ch: 7, Uin: 0÷25V Min Qty: 1 786
  • 1 $0.7180
  • 5 $0.5380
  • 25 $0.4750
  • 100 $0.4290
  • 500 $0.3980
$0.3980 / $0.7180 Buy Now
LCSC Seven channels 50V 500mA SOP-16 Darlington Transistor Arrays ROHS 18531
  • 1 $0.6503
  • 10 $0.5296
  • 30 $0.4708
  • 100 $0.4104
  • 500 $0.3757
  • 1,000 $0.3169
$0.3169 / $0.6503 Buy Now
Vyrian Interface ICs 1177
RFQ
Win Source Electronics   30000
  • 235 $0.2506
  • 565 $0.2056
  • 870 $0.1998
  • 1,200 $0.1929
  • 1,545 $0.1871
  • 2,070 $0.1675
$0.1675 / $0.2506 Buy Now

Part Details for TBD62003AFWG

TBD62003AFWG CAD Models

TBD62003AFWG Part Data Attributes

TBD62003AFWG Toshiba America Electronic Components
Buy Now Datasheet
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TBD62003AFWG Toshiba America Electronic Components Interface Driver, Transistor Array
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TOSHIBA CORP
Package Description SOP-16
Reach Compliance Code compliant
Samacsys Manufacturer Toshiba
Built-in Protections TRANSIENT
Driver Number of Bits 1
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PDSO-G16
Length 10 mm
Number of Functions 7
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Current Flow Direction SINK
Output Current-Max 0.4 A
Output Peak Current Limit-Nom 0.4 A
Output Polarity INVERTED
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.73 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max 25 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology DMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Turn-off Time 0.8 µs
Turn-on Time 0.4 µs
Width 3.94 mm

TBD62003AFWG Related Parts

TBD62003AFWG Frequently Asked Questions (FAQ)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.

  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended operating conditions and derating guidelines.

  • The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause damage to the device.

  • Yes, the TBD62003AFWG is designed to operate in a humid environment, but it's recommended to follow proper moisture sensitivity level (MSL) handling and storage procedures to prevent damage.

  • Check the input voltage, ensure proper power sequencing, verify the enable pin is properly biased, and check for any short circuits or damage to the device or PCB.

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