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Interface Driver, Transistor Array
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TBD62003AFWG by Toshiba America Electronic Components is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TBD62003AFWG
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TME | IC: driver, transistor array, PSOP16, 0.5A, 2÷50V, Ch: 7, Uin: 0÷25V Min Qty: 1 | 786 |
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$0.3980 / $0.7180 | Buy Now |
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LCSC | Seven channels 50V 500mA SOP-16 Darlington Transistor Arrays ROHS | 18531 |
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$0.3169 / $0.6503 | Buy Now |
|
Vyrian | Interface ICs | 1177 |
|
RFQ | |
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Win Source Electronics | 30000 |
|
$0.1675 / $0.2506 | Buy Now |
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TBD62003AFWG
Toshiba America Electronic Components
Buy Now
Datasheet
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Compare Parts:
TBD62003AFWG
Toshiba America Electronic Components
Interface Driver, Transistor Array
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TOSHIBA CORP | |
Package Description | SOP-16 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | Toshiba | |
Built-in Protections | TRANSIENT | |
Driver Number of Bits | 1 | |
Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
JESD-30 Code | R-PDSO-G16 | |
Length | 10 mm | |
Number of Functions | 7 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Current Flow Direction | SINK | |
Output Current-Max | 0.4 A | |
Output Peak Current Limit-Nom | 0.4 A | |
Output Polarity | INVERTED | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP16,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.73 mm | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max | 25 V | |
Supply Voltage-Min | 2.5 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | DMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Turn-off Time | 0.8 µs | |
Turn-on Time | 0.4 µs | |
Width | 3.94 mm |
Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended operating conditions and derating guidelines.
The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause damage to the device.
Yes, the TBD62003AFWG is designed to operate in a humid environment, but it's recommended to follow proper moisture sensitivity level (MSL) handling and storage procedures to prevent damage.
Check the input voltage, ensure proper power sequencing, verify the enable pin is properly biased, and check for any short circuits or damage to the device or PCB.