Part Details for SY89871UMG by Microchip Technology Inc
Results Overview of SY89871UMG by Microchip Technology Inc
- Distributor Offerings: (20 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SY89871UMG Information
SY89871UMG by Microchip Technology Inc is a Clock Driver.
Clock Drivers are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Price & Stock for SY89871UMG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
10AC9209
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Newark | Clk Divider/Fanout Buffer, 2.5Ghz, Qfn, Clock Ic Type:Clock Divider, Fanout Buffer, Frequency:2.5Ghz, No. Of Outputs:3Outputs, Supply Voltage Min:2.37V, Supply Voltage Max:3.6V, Clock Ic Case Style:Qfn, No. Of Pins:16Pins Rohs Compliant: Yes |Microchip SY89871UMG RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 177 |
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$8.5900 / $9.3700 | Buy Now |
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DISTI #
576-1435-ND
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DigiKey | IC CLK BUFFER 1:3 2.5GHZ 16MLF Min Qty: 1 Lead time: 8 Weeks Container: Tube | Temporarily Out of Stock |
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$10.1500 / $13.4000 | Buy Now |
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DISTI #
SY89871UMG
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Avnet Americas | Clock Buffer, Divider, Fanout 3.2 GHz to 2 Outputs, 2.375 V to 3.63 V, 16 Pins, QFN-EP - Rail/Tube (Alt: SY89871UMG) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Lead time: 8 Weeks, 0 Days Container: Tube | 0 |
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$5.9319 / $6.3375 | Buy Now |
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DISTI #
998-SY89871UMG
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Mouser Electronics | Clock Drivers & Distribution 2.5V/3.3V PECL Output Clock Divider/Fanout RoHS: Compliant | 69 |
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$10.1500 / $13.4000 | Buy Now |
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DISTI #
V36:1790_07853403
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Arrow Electronics | Clock Divider/Fanout Buffer 3-OUT 1-IN 1:1/1:2 16-Pin QFN EP Tube RoHS: Compliant Min Qty: 100 Package Multiple: 100 Lead time: 8 Weeks Date Code: 2307 | Americas - 111 |
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$8.5280 | Buy Now |
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DISTI #
V99:2348_07853403
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Arrow Electronics | Clock Divider/Fanout Buffer 3-OUT 1-IN 1:1/1:2 16-Pin QFN EP Tube RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 8 Weeks Date Code: 2307 | Americas - 13 |
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$7.7910 / $8.6780 | Buy Now |
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DISTI #
SY89871UMG
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Microchip Technology Inc | 2.5V/3.3V PECL Output Clock Divider/Fanout, VQFN, Projected EOL: 2034-11-02 COO: Malaysia ECCN: EAR99 RoHS: Compliant Lead time: 8 Weeks, 0 Days Container: Tube |
6700 Alternates Available |
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$7.8100 / $13.4000 | Buy Now |
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Future Electronics | SY89871U-2.5GHz Any Diff. In-to-LVPECL Programmable Clock Divider/ Fanout Buffer RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Lead time: 8 Weeks Container: Tube | 92Tube |
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$5.7700 / $6.0200 | Buy Now |
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Onlinecomponents.com | Clock Divider Buffer - 6 Out 1 In - 16-Pin QFN EP - Tube RoHS: Compliant |
200 In Stock 7000 Factory Stock |
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$6.9600 / $10.4500 | Buy Now |
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DISTI #
66991606
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Verical | Clock Divider/Fanout Buffer 3-OUT 1-IN 1:1/1:2 16-Pin QFN EP Tube RoHS: Compliant Min Qty: 5 Package Multiple: 5 Date Code: 2307 | Americas - 200 |
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$8.3529 / $12.2941 | Buy Now |
Part Details for SY89871UMG
SY89871UMG CAD Models
SY89871UMG Part Data Attributes
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SY89871UMG
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
SY89871UMG
Microchip Technology Inc
89871 SERIES, LOW SKEW CLOCK DRIVER, 3 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | QFN-16 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Microchip | |
| Additional Feature | IT ALSO OPERATE ON 3.3V SUPPLY | |
| Family | 89871 | |
| Input Conditioning | DIFFERENTIAL | |
| JESD-30 Code | S-XQCC-N16 | |
| JESD-609 Code | e4 | |
| Length | 3 mm | |
| Logic IC Type | LOW SKEW CLOCK DRIVER | |
| Moisture Sensitivity Level | 2 | |
| Number of Functions | 1 | |
| Number of Inverted Outputs | ||
| Number of Terminals | 16 | |
| Number of True Outputs | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC16,.12SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Packing Method | TR | |
| Power Supply Current-Max (ICC) | 75 mA | |
| Prop. Delay@Nom-Sup | 0.71 ns | |
| Propagation Delay (tpd) | 0.71 ns | |
| Qualification Status | Not Qualified | |
| Same Edge Skew-Max (tskwd) | 0.03 ns | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.37 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 3 mm | |
| fmax-Min | 2500 MHz |
Alternate Parts for SY89871UMG
This table gives cross-reference parts and alternative options found for SY89871UMG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SY89871UMG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| SY89871UMG-TR | Microchip Technology Inc | $12.7150 | 89871 SERIES, LOW SKEW CLOCK DRIVER, 3 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16 | SY89871UMG vs SY89871UMG-TR |
SY89871UMG Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
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Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal vias to keep the junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
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Use a combination of high-frequency and low-frequency decoupling capacitors (e.g., 0.1 μF and 10 μF) placed close to the device. Ensure the power supply is stable and well-regulated to prevent voltage drops.
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Use the device's power-saving features such as clock gating, dynamic voltage and frequency scaling, and shutdown modes. Optimize the system's power management strategy to minimize idle power consumption.
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Use a shielded enclosure, keep sensitive signals away from the PCB edge, and use EMI filters or common-mode chokes on I/O lines. Ensure proper grounding and bonding of the PCB and enclosure.