Part Details for SUB65P06-20-E3 by Vishay Intertechnologies
Results Overview of SUB65P06-20-E3 by Vishay Intertechnologies
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
SUB65P06-20-E3 Information
SUB65P06-20-E3 by Vishay Intertechnologies is an Other Transistor.
Other Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for SUB65P06-20-E3
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 138 |
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RFQ | ||
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Chip 1 Exchange | INSTOCK | 265 |
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RFQ | |
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Vyrian | Transistors | 416 |
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RFQ |
Part Details for SUB65P06-20-E3
SUB65P06-20-E3 CAD Models
SUB65P06-20-E3 Part Data Attributes
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SUB65P06-20-E3
Vishay Intertechnologies
Buy Now
Datasheet
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Compare Parts:
SUB65P06-20-E3
Vishay Intertechnologies
Transistor
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | VISHAY INTERTECHNOLOGY INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | Vishay | |
| Configuration | SINGLE | |
| Drain Current-Max (ID) | 65 A | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 175 °C | |
| Operating Temperature-Min | -55 °C | |
| Polarity/Channel Type | P-CHANNEL | |
| Power Dissipation-Max (Abs) | 187 W | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
SUB65P06-20-E3 Frequently Asked Questions (FAQ)
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The recommended PCB footprint for the SUB65P06-20-E3 is a standard SOT-223 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
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To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the device on the pads. Use a reflow oven or a hot air gun to solder the device. Make sure to follow the recommended soldering profile and avoid overheating the device.
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The maximum operating temperature range for the SUB65P06-20-E3 is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance.
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The SUB65P06-20-E3 is a commercial-grade device, and it may not meet the stringent requirements of high-reliability or aerospace applications. For such applications, it's recommended to use a device that is specifically designed and qualified for high-reliability or aerospace use, such as a device with a higher temperature rating, radiation hardening, or other specialized features.
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The SUB65P06-20-E3 is an ESD-sensitive device, and it's essential to handle it with care to prevent damage. Use an ESD wrist strap or mat, and ensure that all equipment and tools are grounded. Avoid touching the device's pins or exposed metal surfaces, and use ESD-safe packaging and storage materials.