Part Details for STV300NH02L by STMicroelectronics
Results Overview of STV300NH02L by STMicroelectronics
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Energy and Power Systems
Renewable Energy
STV300NH02L Information
STV300NH02L by STMicroelectronics is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for STV300NH02L
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
V36:1790_06567897
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Arrow Electronics | Trans MOSFET N-CH 24V 200A 10-Pin PowerSO EP T/R Min Qty: 600 Package Multiple: 600 Lead time: 52 Weeks Date Code: 2337 | Americas - 6600 |
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$2.1183 / $2.5530 | Buy Now |
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STMicroelectronics | N-channel 24 V, 0.8 mOhm, 120 A PowerSO-10 RoHS: Compliant Min Qty: 1 | 56 |
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$4.6300 / $6.2700 | Buy Now |
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DISTI #
80553738
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Verical | Trans MOSFET N-CH 24V 200A 10-Pin PowerSO EP T/R Min Qty: 600 Package Multiple: 600 Date Code: 2337 | Americas - 6600 |
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$2.1183 / $2.5312 | Buy Now |
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ComSIT USA | N-CHANNEL 24 V-0.8 MILLI OHM-280 A-POWER SO-10 STRIPFET POWER MOSFET Power Field-Effect Transistor, 280A I(D), 24V, 0.001ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET ECCN: EAR99 RoHS: Compliant |
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RFQ | |
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DISTI #
STV300NH02L
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Avnet Silica | Trans MOSFET NCH 24V 200A 10Pin102Tab PowerSO TR (Alt: STV300NH02L) RoHS: Compliant Min Qty: 600 Package Multiple: 600 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
STV300NH02L
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EBV Elektronik | Trans MOSFET NCH 24V 200A 10Pin102Tab PowerSO TR (Alt: STV300NH02L) RoHS: Compliant Min Qty: 600 Package Multiple: 600 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for STV300NH02L
STV300NH02L CAD Models
STV300NH02L Part Data Attributes
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STV300NH02L
STMicroelectronics
Buy Now
Datasheet
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STV300NH02L
STMicroelectronics
N-channel 24 V, 0.8 mOhm, 120 A PowerSO-10
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | SOT | |
| Package Description | ROHS COMPLIANT, SOP-10 | |
| Pin Count | 10 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Avalanche Energy Rating (Eas) | 2296 mJ | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 24 V | |
| Drain Current-Max (ID) | 280 A | |
| Drain-source On Resistance-Max | 0.001 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-XDSO-G10 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Elements | 1 | |
| Number of Terminals | 10 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 175 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 250 | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 300 W | |
| Pulsed Drain Current-Max (IDM) | 1120 A | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
STV300NH02L Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
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To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STV300NH02L). Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
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The recommended soldering conditions for the STV300NH02L are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature ramp-up rate of 3°C/second. It's also recommended to use a soldering iron with a temperature control system to prevent overheating.
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To prevent damage during storage and shipping, handle the device by the body, not the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging materials, such as anti-static bags or tubes, to prevent electrostatic discharge (ESD) damage.
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The recommended electrical connections for the STV300NH02L involve connecting the drain (D) to the load, the source (S) to the ground, and the gate (G) to a voltage source. Ensure that the gate voltage is within the recommended range (up to 20V) and that the device is operated within the recommended current and power ratings.