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Part Details for STM708TDS6F by STMicroelectronics
Results Overview of STM708TDS6F by STMicroelectronics
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Healthcare
Telecommunications
STM708TDS6F Information
STM708TDS6F by STMicroelectronics is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for STM708TDS6F
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
STM708TDS6F-ND
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DigiKey | IC SUPERVISOR 1 CHANNEL 8TSSOP Min Qty: 4000 Lead time: 24 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$0.5882 / $0.6071 | Buy Now |
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DISTI #
STM708TDS6F
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Avnet Americas | Processor Supervisor 3.08V 1V to 5.5V 8-Pin TSSOP T/R - Tape and Reel (Alt: STM708TDS6F) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 24 Weeks, 0 Days Container: Reel | 0 |
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$0.4738 / $0.4835 | Buy Now |
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DISTI #
511-STM708TDS6F
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Mouser Electronics | Supervisory Circuits Advanced Analog RoHS: Compliant | 72 |
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$0.5850 / $2.1800 | Buy Now |
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STMicroelectronics | 3 V Supervisor RoHS: Compliant Min Qty: 1 | 72 |
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$0.8300 / $2.1400 | Buy Now |
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DISTI #
STM708TDS6F
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Avnet Silica | Processor Supervisor 308V 1V to 55V 8Pin TSSOP TR (Alt: STM708TDS6F) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
STM708TDS6F
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EBV Elektronik | Processor Supervisor 308V 1V to 55V 8Pin TSSOP TR (Alt: STM708TDS6F) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 25 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for STM708TDS6F
STM708TDS6F CAD Models
STM708TDS6F Part Data Attributes
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STM708TDS6F
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
STM708TDS6F
STMicroelectronics
3 V Supervisor
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | SOIC | |
| Package Description | 3 X 3 MM, ROHS COMPLIANT, TSSOP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 24 Weeks | |
| Samacsys Manufacturer | STMicroelectronics | |
| Additional Feature | RESET THRESHOLD VOLTAGE IS 3.08V | |
| Adjustable Threshold | NO | |
| Analog IC - Other Type | VOLTAGE SUPERVISOR | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 3 mm | |
| Number of Channels | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP8,.19 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Supply Current-Max (Isup) | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.2 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Threshold Voltage-Nom | +3.08V | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3 mm |
Alternate Parts for STM708TDS6F
This table gives cross-reference parts and alternative options found for STM708TDS6F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of STM708TDS6F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| STM708TDS6E | STMicroelectronics | Check for Price | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8, 3 X 3 MM, ROHS COMPLIANT, TSSOP-8 | STM708TDS6F vs STM708TDS6E |
STM708TDS6F Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in the application note AN5096, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal interface materials, such as thermal pads or thermal grease, to improve heat transfer between the device and the heat sink.
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The maximum allowed voltage on the input pins is specified in the datasheet as Vin(max), which is typically 5.5V. However, it's essential to consider the voltage tolerance and transient voltage suppression to prevent damage from voltage spikes or electrostatic discharge.
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To handle ESD protection, follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Additionally, consider implementing ESD protection circuits, such as TVS diodes or ESD protection arrays, on the PCB to protect the device from electrostatic discharge.
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The recommended decoupling capacitors for the STM708TDS6F are typically 100nF to 1uF ceramic capacitors, placed as close as possible to the device's power pins. The exact value and type of capacitor may vary depending on the specific application and operating frequency.