-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for STGB10NC60KDT4 by STMicroelectronics
Results Overview of STGB10NC60KDT4 by STMicroelectronics
- Distributor Offerings: (17 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
STGB10NC60KDT4 Information
STGB10NC60KDT4 by STMicroelectronics is an IGBT.
IGBTs are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for STGB10NC60KDT4
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
497-5736-1-ND
|
DigiKey | IGBT 600V 20A 65W D2PAK Min Qty: 1 Lead time: 14 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
572 In Stock |
|
$0.6499 / $2.3400 | Buy Now |
|
DISTI #
STGB10NC60KDT4
|
Avnet Americas | Trans IGBT Chip N-CH 600V 20A 3-Pin(2+Tab) D2PAK T/R - Tape and Reel (Alt: STGB10NC60KDT4) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 14 Weeks, 0 Days Container: Reel | 0 |
|
$0.6189 / $0.6581 | Buy Now |
|
DISTI #
511-STGB10NC60KDT4
|
Mouser Electronics | IGBTs N-channel MOSFET RoHS: Compliant | 1597 |
|
$0.6750 / $1.8600 | Buy Now |
|
DISTI #
V72:2272_06560592
|
Arrow Electronics | Trans IGBT Chip N-CH 600V 20A 65W 3-Pin(2+Tab) D2PAK T/R Min Qty: 1 Package Multiple: 1 Lead time: 14 Weeks Date Code: 2240 Container: Cut Strips | Americas - 2984 |
|
$0.6667 / $0.7347 | Buy Now |
|
DISTI #
E02:0323_00211224
|
Arrow Electronics | Trans IGBT Chip N-CH 600V 20A 65W 3-Pin(2+Tab) D2PAK T/R Min Qty: 1000 Package Multiple: 1000 Lead time: 14 Weeks | Europe - 2000 |
|
$0.7565 | Buy Now |
|
DISTI #
70013802
|
RS | STGB10NC60KDT4, IGBT Transistor, 20 A 600 V, 1MHz, 3-Pin D2PAK Min Qty: 5 Package Multiple: 1 Container: Bulk | 0 |
|
$1.5600 / $1.8700 | RFQ |
|
|
STMicroelectronics | 10 A, 600 V short-circuit rugged IGBT COO: China RoHS: Compliant Min Qty: 1 | 1597 |
|
$0.8400 / $1.8200 | Buy Now |
|
DISTI #
65063186
|
Verical | Trans IGBT Chip N-CH 600V 20A 65W 3-Pin(2+Tab) D2PAK T/R Min Qty: 9 Package Multiple: 1 Date Code: 2240 | Americas - 2984 |
|
$0.6667 / $0.7234 | Buy Now |
|
DISTI #
19229078
|
Verical | Trans IGBT Chip N-CH 600V 20A 65W 3-Pin(2+Tab) D2PAK T/R Min Qty: 1000 Package Multiple: 1000 | Americas - 2000 |
|
$0.7530 | Buy Now |
|
DISTI #
STGB10NC60KDT4
|
TME | Transistor: IGBT, 600V, 10A, 65W, D2PAK Min Qty: 1 | 0 |
|
$0.8400 / $1.4200 | RFQ |
Part Details for STGB10NC60KDT4
STGB10NC60KDT4 CAD Models
STGB10NC60KDT4 Part Data Attributes
|
|
STGB10NC60KDT4
STMicroelectronics
Buy Now
Datasheet
|
Compare Parts:
STGB10NC60KDT4
STMicroelectronics
10 A, 600 V short-circuit rugged IGBT
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | D2PAK | |
| Package Description | D2PAK-3 | |
| Pin Count | 3 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 14 Weeks | |
| Samacsys Manufacturer | STMicroelectronics | |
| Case Connection | ISOLATED | |
| Collector Current-Max (IC) | 20 A | |
| Collector-Emitter Voltage-Max | 600 V | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| Gate-Emitter Thr Voltage-Max | 7 V | |
| Gate-Emitter Voltage-Max | 20 V | |
| JESD-30 Code | R-PSSO-G2 | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 245 | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 60 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | GULL WING | |
| Terminal Position | SINGLE | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | POWER CONTROL | |
| Transistor Element Material | SILICON | |
| Turn-off Time-Nom (toff) | 242 ns | |
| Turn-on Time-Nom (ton) | 23 ns |
STGB10NC60KDT4 Frequently Asked Questions (FAQ)
-
The maximum junction temperature for the STGB10NC60KDT4 is 150°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
-
To ensure proper cooling, it's essential to provide a good thermal interface between the device and the heat sink. Apply a thin layer of thermal interface material, and ensure the heat sink is properly mounted and secured. Additionally, ensure good airflow around the device to dissipate heat efficiently.
-
The recommended gate resistor value for the STGB10NC60KDT4 depends on the specific application and switching frequency. A general guideline is to use a gate resistor value between 10 ohms and 100 ohms. However, it's recommended to consult the application note or contact STMicroelectronics support for specific guidance.
-
Yes, the STGB10NC60KDT4 is suitable for high-reliability applications. It's manufactured using a robust process and has undergone rigorous testing to ensure its quality and reliability. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its specified parameters.
-
To protect the STGB10NC60KDT4 from ESD, handle the device by the body or use an anti-static wrist strap. Ensure the workspace and equipment are ESD-protected, and use ESD-protected packaging and storage materials. Additionally, follow proper soldering and assembly techniques to prevent ESD damage during manufacturing.