Part Details for ST7FLIT19BY0M6 by STMicroelectronics
Results Overview of ST7FLIT19BY0M6 by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ST7FLIT19BY0M6 Information
ST7FLIT19BY0M6 by STMicroelectronics is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for ST7FLIT19BY0M6
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
ST7FLIT19BY0M6
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EBV Elektronik | MCU 8bit ST7 CISC 2KB Flash 33V5V 16Pin SO W Tube (Alt: ST7FLIT19BY0M6) RoHS: Compliant Min Qty: 49 Package Multiple: 49 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Part Details for ST7FLIT19BY0M6
ST7FLIT19BY0M6 CAD Models
ST7FLIT19BY0M6 Part Data Attributes
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ST7FLIT19BY0M6
STMicroelectronics
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Datasheet
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ST7FLIT19BY0M6
STMicroelectronics
8-BIT MCU WITH SINGLE VOLTAGE FLASH MEMORY, DATA EEPROM, ADC, 5 TIMERS, SPI
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | SOIC | |
Package Description | 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 | |
Pin Count | 16 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | STMicroelectronics | |
Has ADC | YES | |
Additional Feature | ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ | |
Address Bus Width | ||
Bit Size | 8 | |
Boundary Scan | NO | |
CPU Family | ST72 | |
Clock Frequency-Max | 16 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PDSO-G16 | |
JESD-609 Code | e4 | |
Length | 10.3 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 17 | |
Number of Terminals | 16 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP16,.4 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 256 | |
ROM (words) | 2048 | |
ROM Programmability | FLASH | |
Seated Height-Max | 2.65 mm | |
Speed | 8 MHz | |
Supply Current-Max | 9 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7.5 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
ST7FLIT19BY0M6 Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
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The ST7FLIT19BY0M6 has a built-in wear leveling mechanism to ensure even wear across the flash memory. However, it's still recommended to implement a wear leveling algorithm in the firmware to further extend the memory's lifespan. Additionally, follow the guidelines for flash memory usage and avoid excessive write cycles to minimize wear.
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The ST7FLIT19BY0M6 has a maximum junction temperature of 150°C. Ensure proper thermal management by providing adequate heat dissipation through a heat sink, thermal vias, or a thermally conductive PCB substrate. Also, follow the recommended operating conditions and avoid overheating to prevent device damage.
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The ST7FLIT19BY0M6 has a built-in secure boot mechanism that can be enabled to ensure the authenticity and integrity of the firmware. Implement firmware encryption using the device's cryptographic accelerators and follow the guidelines in the STMicroelectronics' secure boot application note (AN4838) to ensure secure firmware updates and prevent unauthorized access.
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Follow the guidelines in the STMicroelectronics' EMC application note (AN2679) to ensure the device meets the required EMC standards. Implement proper PCB layout, grounding, and shielding techniques to minimize EMI. Additionally, use the device's built-in EMI filters and follow the recommended operating conditions to reduce electromagnetic radiation.