Datasheets
ST7FLIT19BY0M6 by: STMicroelectronics

8-BIT MCU WITH SINGLE VOLTAGE FLASH MEMORY, DATA EEPROM, ADC, 5 TIMERS, SPI

Part Details for ST7FLIT19BY0M6 by STMicroelectronics

Results Overview of ST7FLIT19BY0M6 by STMicroelectronics

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

ST7FLIT19BY0M6 Information

ST7FLIT19BY0M6 by STMicroelectronics is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for ST7FLIT19BY0M6

Part # Distributor Description Stock Price Buy
DISTI # ST7FLIT19BY0M6
EBV Elektronik MCU 8bit ST7 CISC 2KB Flash 33V5V 16Pin SO W Tube (Alt: ST7FLIT19BY0M6) RoHS: Compliant Min Qty: 49 Package Multiple: 49 Lead time: 143 Weeks, 0 Days EBV - 0
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Part Details for ST7FLIT19BY0M6

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ST7FLIT19BY0M6 Part Data Attributes

ST7FLIT19BY0M6 STMicroelectronics
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ST7FLIT19BY0M6 STMicroelectronics 8-BIT MCU WITH SINGLE VOLTAGE FLASH MEMORY, DATA EEPROM, ADC, 5 TIMERS, SPI
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code SOIC
Package Description 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16
Pin Count 16
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Samacsys Manufacturer STMicroelectronics
Has ADC YES
Additional Feature ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ
Address Bus Width
Bit Size 8
Boundary Scan NO
CPU Family ST72
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-PDSO-G16
JESD-609 Code e4
Length 10.3 mm
Moisture Sensitivity Level 3
Number of I/O Lines 17
Number of Terminals 16
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP16,.4
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 256
ROM (words) 2048
ROM Programmability FLASH
Seated Height-Max 2.65 mm
Speed 8 MHz
Supply Current-Max 9 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

ST7FLIT19BY0M6 Related Parts

ST7FLIT19BY0M6 Frequently Asked Questions (FAQ)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).

  • The ST7FLIT19BY0M6 has a built-in wear leveling mechanism to ensure even wear across the flash memory. However, it's still recommended to implement a wear leveling algorithm in the firmware to further extend the memory's lifespan. Additionally, follow the guidelines for flash memory usage and avoid excessive write cycles to minimize wear.

  • The ST7FLIT19BY0M6 has a maximum junction temperature of 150°C. Ensure proper thermal management by providing adequate heat dissipation through a heat sink, thermal vias, or a thermally conductive PCB substrate. Also, follow the recommended operating conditions and avoid overheating to prevent device damage.

  • The ST7FLIT19BY0M6 has a built-in secure boot mechanism that can be enabled to ensure the authenticity and integrity of the firmware. Implement firmware encryption using the device's cryptographic accelerators and follow the guidelines in the STMicroelectronics' secure boot application note (AN4838) to ensure secure firmware updates and prevent unauthorized access.

  • Follow the guidelines in the STMicroelectronics' EMC application note (AN2679) to ensure the device meets the required EMC standards. Implement proper PCB layout, grounding, and shielding techniques to minimize EMI. Additionally, use the device's built-in EMI filters and follow the recommended operating conditions to reduce electromagnetic radiation.

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