Part Details for SPAKXC309VF100A by NXP Semiconductors
Results Overview of SPAKXC309VF100A by NXP Semiconductors
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SPAKXC309VF100A Information
SPAKXC309VF100A by NXP Semiconductors is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for SPAKXC309VF100A
SPAKXC309VF100A CAD Models
SPAKXC309VF100A Part Data Attributes
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SPAKXC309VF100A
NXP Semiconductors
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Datasheet
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SPAKXC309VF100A
NXP Semiconductors
24-BIT, 100MHz, OTHER DSP, PBGA196
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 15 X 15 MM, 1 MM PITCH, MOLD ARRAY PROCESS, BGA-196 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 18 | |
| Barrel Shifter | YES | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 24 | |
| Format | FIXED POINT | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PBGA-B196 | |
| Length | 15 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 196 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |