Part Details for SP3225EEY-L by Sipex Corporation
Results Overview of SP3225EEY-L by Sipex Corporation
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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SP3225EEY-L Information
SP3225EEY-L by Sipex Corporation is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part Details for SP3225EEY-L
SP3225EEY-L CAD Models
SP3225EEY-L Part Data Attributes
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SP3225EEY-L
Sipex Corporation
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Datasheet
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SP3225EEY-L
Sipex Corporation
Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, PDSO20, ROHS COMPLIANT, MO-153AC, TSSOP-20
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SIPEX CORP | |
| Package Description | ROHS COMPLIANT, MO-153AC, TSSOP-20 | |
| Reach Compliance Code | unknown | |
| Differential Output | NO | |
| Driver Number of Bits | 2 | |
| Input Characteristics | SCHMITT TRIGGER | |
| Interface IC Type | LINE TRANSCEIVER | |
| Interface Standard | EIA-232-F; TIA-232-F | |
| JESD-30 Code | R-PDSO-G20 | |
| JESD-609 Code | e3 | |
| Length | 6.5 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 2 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Receive Delay-Max | ||
| Receiver Number of Bits | 2 | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 4.4 mm |
SP3225EEY-L Frequently Asked Questions (FAQ)
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The recommended layout and placement for the SP3225EEY-L involves keeping the device away from high-frequency noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, the device should be placed near the connector to minimize the length of the transmission lines.
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To ensure reliable operation of the SP3225EEY-L in high-temperature environments, it is essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range, and the junction temperature should be monitored to prevent overheating.
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The SP3225EEY-L has built-in ESD protection, but it is still essential to follow proper ESD handling and protection procedures during manufacturing, testing, and assembly. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD protection devices such as wrist straps and mats.
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To troubleshoot common issues with the SP3225EEY-L, it is essential to follow a systematic approach. This includes verifying the device configuration, checking the power supply and clock signals, and monitoring the transmission lines for noise and distortion. Additionally, using diagnostic tools such as logic analyzers and oscilloscopes can help identify the root cause of the issue.
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When using the SP3225EEY-L in a system with multiple transceivers, it is essential to ensure that each transceiver has its own dedicated clock signal and that the transmission lines are properly terminated. Additionally, the system should be designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI) between the transceivers.