Part Details for SP000928950 by Infineon Technologies AG
Results Overview of SP000928950 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Space Technology
Smart Cities
Aerospace and Defense
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
SP000928950 Information
SP000928950 by Infineon Technologies AG is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for SP000928950
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
726-SP000928950
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Mouser Electronics | MOSFETs N-Ch 55V 540mA SOT-23-3 RoHS: Compliant | 16450 |
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$0.0410 / $0.3900 | Buy Now |
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DISTI #
SP000928950
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EBV Elektronik | Power MOSFET N Channel 55 V 540 mA 650 mOhm SOT23 3 Pins Surface Mount (Alt: SP000928950) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 15 Weeks, 0 Days | EBV - 141000 |
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Buy Now | |
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DISTI #
SP000928950
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EBV Elektronik | Power MOSFET N Channel 55 V 540 mA 650 mOhm SOT23 3 Pins Surface Mount (Alt: SP000928950) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 15 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for SP000928950
SP000928950 CAD Models
SP000928950 Part Data Attributes
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SP000928950
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
SP000928950
Infineon Technologies AG
Small Signal Field-Effect Transistor, 0.54A I(D), 55V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | Infineon | |
| Additional Feature | AVALANCHE RATED | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 55 V | |
| Drain Current-Max (ID) | 0.54 A | |
| Drain-source On Resistance-Max | 0.825 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| Feedback Cap-Max (Crss) | 10 pF | |
| JESD-30 Code | R-PDSO-G3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Polarity/Channel Type | N-CHANNEL | |
| Reference Standard | AEC-Q101 | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
SP000928950 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal conductivity of 1 W/mK for the PCB material.
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Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots. Monitor junction temperature and adjust the system design accordingly.
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Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Ensure a soldering iron temperature of 350°C (662°F) for hand soldering.
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Use an ESD-protected workstation and follow proper handling procedures. Implement ESD protection circuits, such as TVS diodes or ESD arrays, in the system design.
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Operating the device beyond the recommended conditions can lead to reduced reliability, decreased performance, and increased risk of failure. Ensure that the system design operates within the specified parameters to maintain optimal performance and reliability.