Part Details for SMP3003-TL-1E by onsemi
Results Overview of SMP3003-TL-1E by onsemi
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SMP3003-TL-1E Information
SMP3003-TL-1E by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for SMP3003-TL-1E
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
11X3837
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Newark | Pch 100A 75V 4V Drive To263/Reel |Onsemi SMP3003-TL-1E RoHS: Not Compliant Min Qty: 800 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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Buy Now | |
DISTI #
42AC1846
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Newark | Mosfet, P-Ch, -75V, -100A, To-263-3, Channel Type:P Channel, Drain Source Voltage Vds:75V, Continuous Drain Current Id:100A, Transistor Mounting:Surface Mount, Rds(On) Test Voltage:10V, Gate Source Threshold Voltage Max:- Rohs Compliant: Yes |Onsemi SMP3003-TL-1E RoHS: Compliant Min Qty: 800 Package Multiple: 1 Date Code: 0 Container: Cut Tape | 0 |
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Buy Now | |
DISTI #
SMP3003-TL-1E
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Avnet Silica | Trans MOSFET PCH 75V 100A 2Pin TO263 TR (Alt: SMP3003-TL-1E) RoHS: Compliant Min Qty: 800 Package Multiple: 800 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Cytech Systems Limited | MOSFET P-CH 75V 100A D2PAK | 2400 |
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RFQ | |
DISTI #
SMP3003-TL-1E
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EBV Elektronik | Trans MOSFET PCH 75V 100A 2Pin TO263 TR (Alt: SMP3003-TL-1E) RoHS: Compliant Min Qty: 800 Package Multiple: 800 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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LCSC | 75V 100A 6.2m10V50A 90W 2.6V 1 piece P-channel D2PAK MOSFETs ROHS | 10 |
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$2.7730 / $2.9179 | Buy Now |
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Vyrian | Transistors | 62 |
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RFQ | |
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Win Source Electronics | MOSFET P-CH 75V 100A SMP-FD | 4500 |
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$29.6070 / $44.4106 | Buy Now |
Part Details for SMP3003-TL-1E
SMP3003-TL-1E CAD Models
SMP3003-TL-1E Part Data Attributes
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SMP3003-TL-1E
onsemi
Buy Now
Datasheet
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Compare Parts:
SMP3003-TL-1E
onsemi
P-Channel Power MOSFET -75V, -100A, 8mΩ, D2PAK / TO-263-2L, 800-REEL
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Package Description | LEAD FREE, TO-263, 3/2 PIN | |
Pin Count | 2 | |
Manufacturer Package Code | 418AJ | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
Samacsys Manufacturer | onsemi | |
Avalanche Energy Rating (Eas) | 468 mJ | |
Case Connection | DRAIN | |
Configuration | SINGLE WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 75 V | |
Drain Current-Max (ID) | 100 A | |
Drain-source On Resistance-Max | 0.011 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
JEDEC-95 Code | TO-263AB | |
JESD-30 Code | R-PSSO-G2 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Mode | ENHANCEMENT MODE | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 245 | |
Polarity/Channel Type | P-CHANNEL | |
Pulsed Drain Current-Max (IDM) | 400 A | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Position | SINGLE | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transistor Element Material | SILICON |
Alternate Parts for SMP3003-TL-1E
This table gives cross-reference parts and alternative options found for SMP3003-TL-1E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SMP3003-TL-1E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
SMP3003-DL-1E | SANYO Semiconductor Co Ltd | Check for Price | Power Field-Effect Transistor, | SMP3003-TL-1E vs SMP3003-DL-1E |
SMP3003-DL-1E | onsemi | Check for Price | P-Channel Power MOSFET -75V, -100A, 8mΩ, D2PAK / TO-263-2L, 800-REEL | SMP3003-TL-1E vs SMP3003-DL-1E |
SMP3003-TL-1E Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or perform thermal simulations to ensure optimal performance.
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The SMP3003-TL-1E requires a specific biasing scheme to operate within its recommended operating conditions. Ensure that the input voltage (VIN) is within the recommended range (4.5V to 5.5V), and the output voltage (VOUT) is set to the desired level using the feedback resistors (RFBT and RFBG). Consult the datasheet for the recommended biasing scheme and component values.
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When selecting external components, consider the input and output capacitors (CIN and COUT), feedback resistors (RFBT and RFBG), and the inductor (L). Choose components with low ESR, high ripple current rating, and suitable temperature ratings to ensure reliable operation and minimize losses.
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To troubleshoot issues, start by verifying the PCB layout, component selection, and biasing scheme. Check for proper decoupling, and ensure that the input and output capacitors are properly sized. Use an oscilloscope to monitor the input and output waveforms, and consult the datasheet for troubleshooting guidelines and application notes.
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Proper thermal management is crucial for the SMP3003-TL-1E. Ensure good thermal contact between the device and the heat sink, and consider using thermal interface materials (TIMs) to minimize thermal resistance. The heat sink should be designed to dissipate heat efficiently, and the system should be designed to minimize airflow obstruction.