Datasheets
SL811HST-AXC by:

USB Bus Controller, CMOS, PQFP48,

Part Details for SL811HST-AXC by Infineon Technologies AG

Results Overview of SL811HST-AXC by Infineon Technologies AG

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Applications Consumer Electronics Computing and Data Storage Healthcare Medical Imaging

SL811HST-AXC Information

SL811HST-AXC by Infineon Technologies AG is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
SN74AXCH2T45DCUR Texas Instruments 2-bit 0.65V to 3.6V AXC dual-supply bus transciever with bus-hold
SN74AXCH2T45DTMR Texas Instruments 2-bit 0.65V to 3.6V AXC dual-supply bus transciever with bus-hold 8-X2SON -40 to 125

Price & Stock for SL811HST-AXC

Part # Distributor Description Stock Price Buy
DISTI # SP005678992
EBV Elektronik Embedded USB Host Controller 48Pin TQFP Tray (Alt: SP005678992) RoHS: Compliant Min Qty: 1250 Package Multiple: 1250 Lead time: 143 Weeks, 0 Days EBV - 0
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Part Details for SL811HST-AXC

SL811HST-AXC CAD Models

SL811HST-AXC Part Data Attributes

SL811HST-AXC Infineon Technologies AG
Buy Now Datasheet
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SL811HST-AXC Infineon Technologies AG USB Bus Controller, CMOS, PQFP48,
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Reach Compliance Code compliant
Samacsys Manufacturer Infineon
Address Bus Width 8
Bus Compatibility ISA; PCMCIA
Clock Frequency-Max 48 MHz
Data Transfer Rate-Max 1.5 MBps
External Data Bus Width 8
JESD-30 Code S-PQFP-G48
JESD-609 Code e3
Length 7 mm
Moisture Sensitivity Level 3
Number of Terminals 48
Operating Temperature-Max 65 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP48,.35SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Supply Current-Max 25 mA
Supply Voltage-Max 3.45 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 7 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, UNIVERSAL SERIAL BUS

Alternate Parts for SL811HST-AXC

This table gives cross-reference parts and alternative options found for SL811HST-AXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SL811HST-AXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
SL811HST-AC Cypress Semiconductor Check for Price USB Bus Controller, CMOS, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-48 SL811HST-AXC vs SL811HST-AC
PDIUSBD12D,118 ST-Ericsson Check for Price USB Bus Controller, CMOS, PDSO28, 7.50 MM , PLASTIC, MS-013, SOT-136-1, SOP-28 SL811HST-AXC vs PDIUSBD12D,118
PDIUSBD12D NXP Semiconductors Check for Price IC UNIVERSAL SERIAL BUS CONTROLLER, PDSO28, 7.50 MM , PLASTIC, MS-013, SOT-136-1, SOP-28, Bus Controller SL811HST-AXC vs PDIUSBD12D

SL811HST-AXC Related Parts

SL811HST-AXC Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.

  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.

  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure safe operation.

  • Optimize the switching frequency based on the application's requirements. A higher switching frequency can reduce losses, but may increase EMI. A lower switching frequency can reduce EMI, but may increase losses. Consult the datasheet and application notes for guidance.

  • Use a shielded layout, decoupling capacitors, and a common-mode choke to reduce EMI. Implement a snubber circuit to reduce voltage spikes and ringing. Ensure proper grounding and shielding of the device and surrounding components.

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