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USB Bus Controller, CMOS, PQFP48,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SL811HST-AXC by Infineon Technologies AG is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
SN74AXCH2T45DCUR | Texas Instruments | 2-bit 0.65V to 3.6V AXC dual-supply bus transciever with bus-hold | |
SN74AXCH2T45DTMR | Texas Instruments | 2-bit 0.65V to 3.6V AXC dual-supply bus transciever with bus-hold 8-X2SON -40 to 125 |
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SP005678992
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EBV Elektronik | Embedded USB Host Controller 48Pin TQFP Tray (Alt: SP005678992) RoHS: Compliant Min Qty: 1250 Package Multiple: 1250 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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SL811HST-AXC
Infineon Technologies AG
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Datasheet
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SL811HST-AXC
Infineon Technologies AG
USB Bus Controller, CMOS, PQFP48,
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | Infineon | |
Address Bus Width | 8 | |
Bus Compatibility | ISA; PCMCIA | |
Clock Frequency-Max | 48 MHz | |
Data Transfer Rate-Max | 1.5 MBps | |
External Data Bus Width | 8 | |
JESD-30 Code | S-PQFP-G48 | |
JESD-609 Code | e3 | |
Length | 7 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 48 | |
Operating Temperature-Max | 65 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP48,.35SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Supply Current-Max | 25 mA | |
Supply Voltage-Max | 3.45 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
This table gives cross-reference parts and alternative options found for SL811HST-AXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SL811HST-AXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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SL811HST-AC | Cypress Semiconductor | Check for Price | USB Bus Controller, CMOS, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-48 | SL811HST-AXC vs SL811HST-AC |
PDIUSBD12D,118 | ST-Ericsson | Check for Price | USB Bus Controller, CMOS, PDSO28, 7.50 MM , PLASTIC, MS-013, SOT-136-1, SOP-28 | SL811HST-AXC vs PDIUSBD12D,118 |
PDIUSBD12D | NXP Semiconductors | Check for Price | IC UNIVERSAL SERIAL BUS CONTROLLER, PDSO28, 7.50 MM , PLASTIC, MS-013, SOT-136-1, SOP-28, Bus Controller | SL811HST-AXC vs PDIUSBD12D |
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure safe operation.
Optimize the switching frequency based on the application's requirements. A higher switching frequency can reduce losses, but may increase EMI. A lower switching frequency can reduce EMI, but may increase losses. Consult the datasheet and application notes for guidance.
Use a shielded layout, decoupling capacitors, and a common-mode choke to reduce EMI. Implement a snubber circuit to reduce voltage spikes and ringing. Ensure proper grounding and shielding of the device and surrounding components.