Part Details for SL3ICS1202FUG/V7AF by NXP Semiconductors
Results Overview of SL3ICS1202FUG/V7AF by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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SL3ICS1202FUG/V7AF Information
SL3ICS1202FUG/V7AF by NXP Semiconductors is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for SL3ICS1202FUG/V7AF
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9741
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Newark | Ucode G2Xm And G2Xl/ Ffc Rohs Compliant: Yes |Nxp SL3ICS1202FUG/V7AF RoHS: Compliant Min Qty: 128151 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$0.0510 | Buy Now |
DISTI #
SL3ICS1202FUG/V7AF
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Avnet Silica | Passive Smart Tag and Label UCODE G2XL IC Wafer EPCglobal v109 (Alt: SL3ICS1202FUG/V7AF) RoHS: Compliant Min Qty: 600000 Package Multiple: 128151 | Silica - 0 |
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Buy Now | |
DISTI #
SL3ICS1202FUG/V7AF
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EBV Elektronik | Passive Smart Tag and Label UCODE G2XL IC Wafer EPCglobal v109 (Alt: SL3ICS1202FUG/V7AF) RoHS: Compliant Min Qty: 12815 Package Multiple: 12815 | EBV - 0 |
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Buy Now |
Part Details for SL3ICS1202FUG/V7AF
SL3ICS1202FUG/V7AF CAD Models
SL3ICS1202FUG/V7AF Part Data Attributes
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SL3ICS1202FUG/V7AF
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SL3ICS1202FUG/V7AF
NXP Semiconductors
SL3ICS1002/1202 - UCODE G2XM and G2XL
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | WAFER | |
Package Description | DIE, | |
Pin Count | 8 | |
Manufacturer Package Code | NAU000 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.32.00 | |
JESD-30 Code | R-XUUC-N8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Shape | RECTANGULAR | |
Package Style | UNCASED CHIP | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
SL3ICS1202FUG/V7AF Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout in the application note AN11538, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
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The SL3ICS1202FUG/V7AF has multiple low-power modes, including Sleep, Deep Sleep, and Hibernate. To configure the device for low-power mode, refer to the device's datasheet and application notes, which provide detailed information on register settings, clock management, and power gating.
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The SL3ICS1202FUG/V7AF has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal vias, and thermal interface materials. NXP provides thermal modeling and simulation tools to help designers optimize their thermal design.
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The SL3ICS1202FUG/V7AF has built-in security features, including secure boot and firmware update mechanisms. NXP provides documentation and software development kits (SDKs) to help designers implement secure boot and firmware update processes, ensuring the integrity and authenticity of the device's firmware.
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The SL3ICS1202FUG/V7AF is designed to meet various EMC and EMI standards. To ensure compliance, designers should follow NXP's guidelines for PCB layout, component selection, and shielding, as well as perform EMC and EMI testing and simulation during the design process.