Datasheets
SL3ICS1202FUG/V7AF by: NXP Semiconductors

SL3ICS1002/1202 - UCODE G2XM and G2XL

Part Details for SL3ICS1202FUG/V7AF by NXP Semiconductors

Results Overview of SL3ICS1202FUG/V7AF by NXP Semiconductors

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SL3ICS1202FUG/V7AF Information

SL3ICS1202FUG/V7AF by NXP Semiconductors is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for SL3ICS1202FUG/V7AF

Part # Distributor Description Stock Price Buy
DISTI # 85AK9741
Newark Ucode G2Xm And G2Xl/ Ffc Rohs Compliant: Yes |Nxp SL3ICS1202FUG/V7AF RoHS: Compliant Min Qty: 128151 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 25,000 $0.0510
$0.0510 Buy Now
DISTI # SL3ICS1202FUG/V7AF
Avnet Silica Passive Smart Tag and Label UCODE G2XL IC Wafer EPCglobal v109 (Alt: SL3ICS1202FUG/V7AF) RoHS: Compliant Min Qty: 600000 Package Multiple: 128151 Silica - 0
Buy Now
DISTI # SL3ICS1202FUG/V7AF
EBV Elektronik Passive Smart Tag and Label UCODE G2XL IC Wafer EPCglobal v109 (Alt: SL3ICS1202FUG/V7AF) RoHS: Compliant Min Qty: 12815 Package Multiple: 12815 EBV - 0
Buy Now

Part Details for SL3ICS1202FUG/V7AF

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SL3ICS1202FUG/V7AF Part Data Attributes

SL3ICS1202FUG/V7AF NXP Semiconductors
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SL3ICS1202FUG/V7AF NXP Semiconductors SL3ICS1002/1202 - UCODE G2XM and G2XL
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code WAFER
Package Description DIE,
Pin Count 8
Manufacturer Package Code NAU000
Reach Compliance Code compliant
HTS Code 8542.32.00
JESD-30 Code R-XUUC-N8
Number of Functions 1
Number of Terminals 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code DIE
Package Shape RECTANGULAR
Package Style UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Surface Mount YES
Technology CMOS
Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Position UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

SL3ICS1202FUG/V7AF Frequently Asked Questions (FAQ)

  • NXP provides a recommended PCB layout in the application note AN11538, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).

  • The SL3ICS1202FUG/V7AF has multiple low-power modes, including Sleep, Deep Sleep, and Hibernate. To configure the device for low-power mode, refer to the device's datasheet and application notes, which provide detailed information on register settings, clock management, and power gating.

  • The SL3ICS1202FUG/V7AF has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal vias, and thermal interface materials. NXP provides thermal modeling and simulation tools to help designers optimize their thermal design.

  • The SL3ICS1202FUG/V7AF has built-in security features, including secure boot and firmware update mechanisms. NXP provides documentation and software development kits (SDKs) to help designers implement secure boot and firmware update processes, ensuring the integrity and authenticity of the device's firmware.

  • The SL3ICS1202FUG/V7AF is designed to meet various EMC and EMI standards. To ensure compliance, designers should follow NXP's guidelines for PCB layout, component selection, and shielding, as well as perform EMC and EMI testing and simulation during the design process.

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