Part Details for SI8900B-A01-GS by Skyworks Solutions Inc
Results Overview of SI8900B-A01-GS by Skyworks Solutions Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Renewable Energy
SI8900B-A01-GS Information
SI8900B-A01-GS by Skyworks Solutions Inc is an Analog to Digital Converter.
Analog to Digital Converters are under the broader part category of Converters.
A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.
Price & Stock for SI8900B-A01-GS
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | Si8900 - ISOLATED MONITORING ADC RoHS: Compliant Status: Obsolete Min Qty: 1 | 668 |
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$2.9200 / $3.6500 | Buy Now |
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Cytech Systems Limited | IC ADC 10BIT SAR 16SOIC | 1250 |
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RFQ |
Part Details for SI8900B-A01-GS
SI8900B-A01-GS CAD Models
SI8900B-A01-GS Part Data Attributes
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SI8900B-A01-GS
Skyworks Solutions Inc
Buy Now
Datasheet
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Compare Parts:
SI8900B-A01-GS
Skyworks Solutions Inc
ADC, Successive Approximation, 10-Bit, 1 Func, 3 Channel, Serial Access, CMOS, PDSO16, SOIC-16
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SKYWORKS SOLUTIONS INC | |
| Package Description | SOIC-16 | |
| Reach Compliance Code | compliant | |
| Analog Input Voltage-Max | 3.6 V | |
| Analog Input Voltage-Min | ||
| Converter Type | ADC, SUCCESSIVE APPROXIMATION | |
| JESD-30 Code | R-PDSO-G16 | |
| Length | 10.3 mm | |
| Linearity Error-Max (EL) | 0.0977% | |
| Number of Analog In Channels | 3 | |
| Number of Bits | 10 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Bit Code | BINARY | |
| Output Format | SERIAL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP16,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.65 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.5 mm |
Alternate Parts for SI8900B-A01-GS
This table gives cross-reference parts and alternative options found for SI8900B-A01-GS. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SI8900B-A01-GS, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| SI8900B-A01-GSR | Skyworks Solutions Inc | Check for Price | ADC, Successive Approximation, 10-Bit, 1 Func, 3 Channel, Serial Access, CMOS, PDSO16, SOIC-16 | SI8900B-A01-GS vs SI8900B-A01-GSR |
SI8900B-A01-GS Frequently Asked Questions (FAQ)
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The recommended PCB layout involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing thermal vias under the device. For thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended thermal pad layout.
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Use a Smith chart or a network analyzer to optimize the input and output matching networks. The goal is to achieve a conjugate match between the device's input/output impedance and the external circuitry. Consult the application note AN-1019 for more information.
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Follow the JEDEC J-STD-020C standard for soldering and handling. Use a soldering iron with a temperature range of 220°C to 240°C, and avoid exposing the device to temperatures above 260°C. Handle the device by the package body, avoiding touching the pins or electrical connections.
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Use a shielded enclosure, keep the device away from high-frequency sources, and use filtering components (e.g., chokes, capacitors) to reduce EMI. Ensure proper grounding and decoupling, and follow the guidelines in the application note AN-1031.
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The SI8900B-A01-GS has undergone various reliability and qualification tests, including temperature cycling, humidity testing, and mechanical stress testing. Refer to the device's qualification report and the Skyworks Solutions Inc. website for more information.