Datasheets
SFH6916 by:

Transistor Output Optocoupler, 4-Element, 3750V Isolation, SOP-16

Part Details for SFH6916 by Infineon Technologies AG

Results Overview of SFH6916 by Infineon Technologies AG

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Applications Security and Surveillance Internet of Things (IoT) Environmental Monitoring Space Technology Industrial Automation Smart Cities Aerospace and Defense Agriculture Technology Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Robotics and Drones

SFH6916 Information

SFH6916 by Infineon Technologies AG is an Optocoupler.
Optocoupler are under the broader part category of Optoelectronics.

Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.

Price & Stock for SFH6916

Part # Distributor Description Stock Price Buy
Bristol Electronics   10
RFQ
Quest Components TRANSISTOR OUTPUT OPTOCOUPLER, 4-ELEMENT, 3750V ISOLATION 8
  • 1 $11.3400
  • 2 $9.4500
  • 4 $8.3160
$8.3160 / $11.3400 Buy Now

Part Details for SFH6916

SFH6916 CAD Models

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SFH6916 Part Data Attributes

SFH6916 Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
SFH6916 Infineon Technologies AG Transistor Output Optocoupler, 4-Element, 3750V Isolation, SOP-16
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description SOP-16
Reach Compliance Code compliant
HTS Code 8541.40.80.00
Samacsys Manufacturer Infineon
Additional Feature UL RECOGNIZED
Coll-Emtr Bkdn Voltage-Min 70 V
Configuration SEPARATE, 4 CHANNELS
Current Transfer Ratio-Nom 50%
Dark Current-Max 100 nA
Forward Current-Max 0.05 A
Isolation Voltage-Max 3750 V
JESD-609 Code e0
Number of Elements 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -55 °C
Optoelectronic Device Type TRANSISTOR OUTPUT OPTOCOUPLER
Terminal Finish Tin/Lead (Sn/Pb)

SFH6916 Related Parts

SFH6916 Frequently Asked Questions (FAQ)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 mm clearance around the device for airflow and heat dissipation.

  • Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans. Ensure the device is operated within the specified temperature range (–40°C to 150°C) and consider derating the device for high-temperature applications.

  • Consider the heat sink's thermal resistance, material, and surface finish. A heat sink with a thermal resistance of ≤ 10°C/W and a surface finish of ≥ 0.5 μm is recommended. Ensure the heat sink is compatible with the device's package and thermal interface material.

  • Use a shielded enclosure, keep sensitive components away from the SFH6916, and ensure proper grounding and decoupling. Implement EMI filters or common-mode chokes if necessary. Follow good PCB design practices, such as minimizing loop areas and using differential signaling.

  • Choose a TIM with a thermal conductivity of ≥ 1 W/mK, a thickness of ≤ 0.5 mm, and a surface roughness of ≤ 0.5 μm. Ensure the TIM is compatible with the device's package and heat sink material.

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