Part Details for SFH6916 by Infineon Technologies AG
Results Overview of SFH6916 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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SFH6916 Information
SFH6916 by Infineon Technologies AG is an Optocoupler.
Optocoupler are under the broader part category of Optoelectronics.
Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.
Price & Stock for SFH6916
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 10 |
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RFQ | ||
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Quest Components | TRANSISTOR OUTPUT OPTOCOUPLER, 4-ELEMENT, 3750V ISOLATION | 8 |
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$8.3160 / $11.3400 | Buy Now |
Part Details for SFH6916
SFH6916 CAD Models
SFH6916 Part Data Attributes
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SFH6916
Infineon Technologies AG
Buy Now
Datasheet
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SFH6916
Infineon Technologies AG
Transistor Output Optocoupler, 4-Element, 3750V Isolation, SOP-16
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | SOP-16 | |
Reach Compliance Code | compliant | |
HTS Code | 8541.40.80.00 | |
Samacsys Manufacturer | Infineon | |
Additional Feature | UL RECOGNIZED | |
Coll-Emtr Bkdn Voltage-Min | 70 V | |
Configuration | SEPARATE, 4 CHANNELS | |
Current Transfer Ratio-Nom | 50% | |
Dark Current-Max | 100 nA | |
Forward Current-Max | 0.05 A | |
Isolation Voltage-Max | 3750 V | |
JESD-609 Code | e0 | |
Number of Elements | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -55 °C | |
Optoelectronic Device Type | TRANSISTOR OUTPUT OPTOCOUPLER | |
Terminal Finish | Tin/Lead (Sn/Pb) |
SFH6916 Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 mm clearance around the device for airflow and heat dissipation.
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Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans. Ensure the device is operated within the specified temperature range (–40°C to 150°C) and consider derating the device for high-temperature applications.
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Consider the heat sink's thermal resistance, material, and surface finish. A heat sink with a thermal resistance of ≤ 10°C/W and a surface finish of ≥ 0.5 μm is recommended. Ensure the heat sink is compatible with the device's package and thermal interface material.
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Use a shielded enclosure, keep sensitive components away from the SFH6916, and ensure proper grounding and decoupling. Implement EMI filters or common-mode chokes if necessary. Follow good PCB design practices, such as minimizing loop areas and using differential signaling.
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Choose a TIM with a thermal conductivity of ≥ 1 W/mK, a thickness of ≤ 0.5 mm, and a surface roughness of ≤ 0.5 μm. Ensure the TIM is compatible with the device's package and heat sink material.