Part Details for SCIMX538DZK1C by NXP Semiconductors
Results Overview of SCIMX538DZK1C by NXP Semiconductors
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
SCIMX538DZK1C Information
SCIMX538DZK1C by NXP Semiconductors is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for SCIMX538DZK1C
SCIMX538DZK1C CAD Models
SCIMX538DZK1C Part Data Attributes
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SCIMX538DZK1C
NXP Semiconductors
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Datasheet
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SCIMX538DZK1C
NXP Semiconductors
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA520
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | POPFCBGA-529 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B529 | |
| Length | 12 mm | |
| Number of Terminals | 529 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA529,23X23,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.986 mm | |
| Supply Voltage-Max | 1.4 V | |
| Supply Voltage-Min | 1.2 V | |
| Supply Voltage-Nom | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
SCIMX538DZK1C Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
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Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Monitor junction temperature (TJ) and adjust the system design accordingly.
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Use a minimum of 2x 10uF ceramic capacitors and 1x 1uF ceramic capacitor per power pin, placed as close to the device as possible. Ensure a low-ESR capacitor for the 1.8V supply.
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Use the device's power-saving features, such as dynamic voltage and frequency scaling, and implement a power gating strategy. Optimize the system's clock frequency and voltage settings.
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Use a shielded enclosure, implement a multi-layer PCB with a solid ground plane, and ensure proper signal routing and termination. Use EMI filters and ferrite beads as needed.