Part Details for SCIMX538DZK1C by Freescale Semiconductor
Results Overview of SCIMX538DZK1C by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SCIMX538DZK1C Information
SCIMX538DZK1C by Freescale Semiconductor is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for SCIMX538DZK1C
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Vyrian | Peripheral ICs | 617 |
|
RFQ |
Part Details for SCIMX538DZK1C
SCIMX538DZK1C CAD Models
SCIMX538DZK1C Part Data Attributes
|
SCIMX538DZK1C
Freescale Semiconductor
Buy Now
Datasheet
|
Compare Parts:
SCIMX538DZK1C
Freescale Semiconductor
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA520, 12 X 12 MM, 0.40 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-520
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | POPFCBGA-529 | |
Pin Count | 520 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-PBGA-B529 | |
Length | 12 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 529 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA529,23X23,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.986 mm | |
Supply Voltage-Max | 1.4 V | |
Supply Voltage-Min | 1.2 V | |
Supply Voltage-Nom | 1.25 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
SCIMX538DZK1C Frequently Asked Questions (FAQ)
-
The recommended operating temperature range for SCIMX538DZK1C is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
-
The SCIMX538DZK1C has an internal clock source, but it can also be configured to use an external clock source. To configure the clock source, you need to set the CLK_SEL pin accordingly. For internal clock source, set CLK_SEL to 0, and for external clock source, set CLK_SEL to 1. Additionally, you need to configure the clock frequency using the CLK_FREQ pin.
-
The maximum current consumption of SCIMX538DZK1C is 150 mA, as specified in the datasheet. However, this value can vary depending on the operating frequency, voltage, and other factors. It's essential to consider the power consumption in your design to ensure reliable operation.
-
The SCIMX538DZK1C has several power-saving modes, including sleep mode, standby mode, and shutdown mode. To implement these modes, you need to set the corresponding control pins (e.g., SLEEP, STBY, and SHDN) accordingly. Additionally, you need to configure the power management registers to enable the desired power-saving mode.
-
The recommended layout and routing for SCIMX538DZK1C involve keeping the power and ground pins separate, using a solid ground plane, and minimizing the length of the clock signal traces. It's also essential to follow the datasheet's guidelines for pin placement, component selection, and thermal management.