Part Details for SC1894A-00B13E by Maxim Integrated Products
Results Overview of SC1894A-00B13E by Maxim Integrated Products
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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SC1894A-00B13E Information
SC1894A-00B13E by Maxim Integrated Products is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for SC1894A-00B13E
SC1894A-00B13E CAD Models
SC1894A-00B13E Part Data Attributes
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SC1894A-00B13E
Maxim Integrated Products
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Datasheet
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SC1894A-00B13E
Maxim Integrated Products
Telecom Circuit, 1-Func, 9 X 9 MM, GREEN, QFN-64
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
| Package Description | HVQCCN, | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-XQCC-N64 | |
| Length | 9 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm |
SC1894A-00B13E Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias connecting the exposed pad to the ground plane is recommended for optimal thermal performance.
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Ensure that the device is properly decoupled, and the power supply is stable and well-regulated. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
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Operating the device at the maximum junction temperature can reduce its lifespan. It's essential to ensure proper thermal management and consider derating the device's performance to ensure reliable operation.
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Yes, but it's essential to follow Maxim Integrated Products' guidelines for high-reliability and safety-critical applications, including implementing proper fault detection and correction mechanisms.
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Use Maxim Integrated Products' troubleshooting guides and application notes, and consider using debug tools and oscilloscopes to analyze the device's behavior and identify the root cause of the issue.