Part Details for SAM9X60-V/DWBVAO by Microchip Technology Inc
Results Overview of SAM9X60-V/DWBVAO by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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SAM9X60-V/DWBVAO Information
SAM9X60-V/DWBVAO by Microchip Technology Inc is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for SAM9X60-V/DWBVAO
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
150-SAM9X60-V/DWBVAO-ND
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DigiKey | IC MPU SAM9X 600MHZ 228TFBGA Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
SAM9X60-V/DWBVAO
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Microchip Technology Inc | ARM926 MPU, BGA, EXT. TEMP, TFBGA, Projected EOL: 2044-07-23 COO: Taiwan ECCN: 5A992.c RoHS: Compliant Lead time: 8 Weeks, 0 Days Container: Tray |
6512 Alternates Available |
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$4.4400 / $6.1100 | Buy Now |
|
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Onlinecomponents.com | RoHS: Compliant | 4752 Factory Stock |
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$0 | Buy Now |
Part Details for SAM9X60-V/DWBVAO
SAM9X60-V/DWBVAO CAD Models
SAM9X60-V/DWBVAO Part Data Attributes
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SAM9X60-V/DWBVAO
Microchip Technology Inc
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Datasheet
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SAM9X60-V/DWBVAO
Microchip Technology Inc
RISC Microprocessor, 32-Bit, 600MHz, CMOS, PBGA228
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 8 Weeks | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 48 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B228 | |
| Length | 11 mm | |
| Low Power Mode | YES | |
| Number of DMA Channels | 16 | |
| Number of External Interrupts | 1 | |
| Number of Terminals | 228 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA228,16X16,26 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| RAM (words) | 69632 | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.2 mm | |
| Speed | 600 MHz | |
| Supply Voltage-Max | 1.21 V | |
| Supply Voltage-Min | 1.12 V | |
| Supply Voltage-Nom | 1.15 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Width | 11 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |