Part Details for SAK-TC1798F-512F300EP by Infineon Technologies AG
Results Overview of SAK-TC1798F-512F300EP by Infineon Technologies AG
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
SAK-TC1798F-512F300EP Information
SAK-TC1798F-512F300EP by Infineon Technologies AG is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for SAK-TC1798F-512F300EP
SAK-TC1798F-512F300EP CAD Models
SAK-TC1798F-512F300EP Part Data Attributes
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SAK-TC1798F-512F300EP
Infineon Technologies AG
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SAK-TC1798F-512F300EP
Infineon Technologies AG
RISC Microcontroller, 32-Bit, FLASH, 300MHz, CMOS, PBGA516, GREEN, PLASTIC, LFBGA-516
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | BGA | |
| Package Description | GREEN, PLASTIC, LFBGA-516 | |
| Pin Count | 516 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Infineon | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | TC1798 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B516 | |
| JESD-609 Code | e1 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 24 | |
| Number of I/O Lines | 238 | |
| Number of Serial I/Os | 8 | |
| Number of Terminals | 516 | |
| Number of Timers | 5 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA516,30X30,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| RAM (bytes) | 294912 | |
| ROM (words) | 4194304 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.7 mm | |
| Speed | 300 MHz | |
| Supply Current-Max | 890 mA | |
| Supply Voltage-Max | 1.365 V | |
| Supply Voltage-Min | 1.235 V | |
| Supply Voltage-Nom | 1.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |