Part Details for SA605DK by NXP Semiconductors
Results Overview of SA605DK by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Entertainment and Gaming
Price & Stock for SA605DK
| Part # | Distributor | Description | Stock | Price | Buy | |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 10 |
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$6.5000 / $10.0000 | Buy Now |
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Vyrian | General Purpose ICs | 1115 |
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RFQ | |
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Win Source Electronics | IC MIXER FM IF SYSTEM LP 20-SSOP | 1800 |
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$45.6987 / $68.5469 | Buy Now |
Part Details for SA605DK
SA605DK CAD Models
SA605DK Part Data Attributes
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SA605DK
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SA605DK
NXP Semiconductors
IC FM, AUDIO SINGLE CHIP RECEIVER, PDSO20, PLASTIC, SSOP-20, Receiver IC
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SSOP | |
| Package Description | PLASTIC, SSOP-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | IN-BUILT QUADRATURE DETECTOR | |
| Consumer IC Type | AUDIO SINGLE CHIP RECEIVER | |
| Demodulation Type | FM | |
| JESD-30 Code | R-PDSO-G20 | |
| JESD-609 Code | e4 | |
| Length | 6.5 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Voltage-Nom (FM) | 150 mV | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Signal to Noise Ratio-Nom (FM) | 73 dB | |
| Supply Current-Max | 6.55 mA | |
| Supply Voltage-Max (Vsup) | 8 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Width | 4.4 mm |
Alternate Parts for SA605DK
This table gives cross-reference parts and alternative options found for SA605DK. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SA605DK, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| SA605D | YAGEO Corporation | Check for Price | Audio Single Chip Receiver, FM, PDSO20, PLASTIC, SOL-20 | SA605DK vs SA605D |
| 935040870118 | NXP Semiconductors | Check for Price | IC FM, AUDIO SINGLE CHIP RECEIVER, PDSO20, 4.40 MM, PLASTIC, SOT-266-1, SSOP-20, Receiver IC | SA605DK vs 935040870118 |
SA605DK Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout in the application note AN11035, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
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The SA605DK can be configured for different frequency bands by adjusting the values of the external components, such as the inductors and capacitors, according to the guidelines provided in the datasheet and application notes.
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The maximum power handling capability of the SA605DK is dependent on the specific application and operating conditions. NXP recommends consulting the application notes and performing thermal simulations to determine the maximum power handling capability for a specific design.
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To ensure EMC with the SA605DK, NXP recommends following the guidelines provided in the application notes, including proper PCB layout, component selection, and shielding. Additionally, performing EMC testing and simulation can help identify and mitigate potential issues.
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The SA605DK requires proper thermal management to ensure reliable operation. NXP recommends using thermal vias, heat sinks, and thermal interface materials to dissipate heat, and performing thermal simulations to determine the optimal thermal design for a specific application.