Part Details for S912XEQ512BMALR by NXP Semiconductors
Results Overview of S912XEQ512BMALR by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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S912XEQ512BMALR Information
S912XEQ512BMALR by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for S912XEQ512BMALR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
63Y8945
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Newark | 16-Bit Mcu, S12X Core, 512Kb Flash, 50Mhz, -40/+125Degc, Automotive Qualified, Qfp 112/ Reel Rohs Compliant: Yes |Nxp S912XEQ512BMALR RoHS: Compliant Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$14.0200 | Buy Now |
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DISTI #
S912XEQ512BMALR-ND
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DigiKey | IC MCU 16BIT 512KB FLASH 112LQFP Min Qty: 500 Lead time: 12 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$16.5529 | Buy Now |
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DISTI #
S912XEQ512BMALR
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Avnet Americas | MCU 16-Bit S12X CISC 512KB Flash 3.3V/5V 112-Pin LQFP T/R - Tape and Reel (Alt: S912XEQ512BMALR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 12 Weeks, 0 Days Container: Reel | 0 |
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$14.2655 / $14.7493 | Buy Now |
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DISTI #
841-S912XEQ512BMALR
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Mouser Electronics | 16-bit Microcontrollers - MCU 16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 112 RoHS: Compliant | 0 |
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$16.4500 | Order Now |
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DISTI #
S912XEQ512BMALR
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Avnet Silica | MCU 16Bit S12X CISC 512KB Flash 33V5V 112Pin LQFP TR (Alt: S912XEQ512BMALR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
S912XEQ512BMALR
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EBV Elektronik | MCU 16Bit S12X CISC 512KB Flash 33V5V 112Pin LQFP TR (Alt: S912XEQ512BMALR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 14 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for S912XEQ512BMALR
S912XEQ512BMALR CAD Models
S912XEQ512BMALR Part Data Attributes
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S912XEQ512BMALR
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
S912XEQ512BMALR
NXP Semiconductors
S912XEQ512BMALR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 12 Weeks | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 16 | |
| CPU Family | CPU12 | |
| Clock Frequency-Max | 40 MHz | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G112 | |
| JESD-609 Code | e3 | |
| Length | 20 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 91 | |
| Number of Terminals | 112 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Equivalence Code | QFP112,.87SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 32768 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100 | |
| Speed | 50 MHz | |
| Supply Current-Max | 100 mA | |
| Supply Voltage-Max | 1.98 V | |
| Supply Voltage-Min | 1.72 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 20 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
S912XEQ512BMALR Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout and thermal management strategy in the S912XEQ512BMALR application note (AN12144). It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
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To optimize power consumption, use the device's low-power modes (e.g., Wait, Stop, and Deep Sleep), reduce clock frequencies, and disable unused peripherals. Additionally, use the Power Management Unit (PMU) to control power domains and optimize voltage scaling.
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Design a power supply that meets the device's voltage and current requirements. Ensure a stable and clean power supply by using a suitable voltage regulator, decoupling capacitors, and a robust power distribution network. Also, consider using a power-on reset (POR) circuit to ensure a clean power-up sequence.
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Follow NXP's EMC guidelines (AN11533) and implement proper PCB design practices, such as using a solid ground plane, minimizing signal loop areas, and using shielding and filtering techniques. Additionally, ensure that your design meets the relevant EMC standards and regulations.
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The S912XEQ512BMALR has built-in security features like secure boot, TrustZone, and cryptographic accelerators. Implement secure firmware updates, use secure communication protocols, and follow NXP's security guidelines (AN12269) to ensure the integrity and confidentiality of your system.