Part Details for S72VS256RE0AHBJ10 by Spansion
Results Overview of S72VS256RE0AHBJ10 by Spansion
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
S72VS256RE0AHBJ10 Information
S72VS256RE0AHBJ10 by Spansion is an Other Memory IC.
Other Memory ICs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for S72VS256RE0AHBJ10
S72VS256RE0AHBJ10 CAD Models
S72VS256RE0AHBJ10 Part Data Attributes
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S72VS256RE0AHBJ10
Spansion
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Datasheet
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S72VS256RE0AHBJ10
Spansion
Memory Circuit, 16MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | |
| Pin Count | 133 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | 256 MBIT (16M X 16 TOP BOOT BLOCK) FLASH MEMORY | |
| JESD-30 Code | S-PBGA-B133 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 133 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 16MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |