Part Details for S72VS256RE0AHBJ10 by Cypress Semiconductor
Results Overview of S72VS256RE0AHBJ10 by Cypress Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
S72VS256RE0AHBJ10 Information
S72VS256RE0AHBJ10 by Cypress Semiconductor is an Other Memory IC.
Other Memory ICs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for S72VS256RE0AHBJ10
S72VS256RE0AHBJ10 CAD Models
S72VS256RE0AHBJ10 Part Data Attributes
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S72VS256RE0AHBJ10
Cypress Semiconductor
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Datasheet
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S72VS256RE0AHBJ10
Cypress Semiconductor
Memory Circuit, 16MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | 256 MBIT (16M X 16 TOP BOOT BLOCK) FLASH MEMORY | |
| JESD-30 Code | S-PBGA-B133 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 133 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 16MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |
S72VS256RE0AHBJ10 Frequently Asked Questions (FAQ)
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The recommended operating temperature range for the S72VS256RE0AHBJ10 is -40°C to 85°C, with a maximum junction temperature of 125°C.
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It is recommended to power up the VCCQ and VCCD pins simultaneously, and power down the VCCQ pin before the VCCD pin to prevent latch-up and ensure proper operation.
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The S72VS256RE0AHBJ10 supports clock frequencies up to 166 MHz, but the actual frequency may vary depending on the system design and operating conditions.
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The CS# signal should be asserted at least one clock cycle before the first address is driven, and de-asserted one clock cycle after the last data is driven. The CS# signal should be kept low for at least one clock cycle between consecutive transactions.
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The WP# pin is used to prevent writes to the status register and the non-volatile memory. When WP# is low, the device is in write-protect mode, and when WP# is high, the device is in normal operation mode.