-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for S70GL02GT12FHIV10 by Infineon Technologies AG
Results Overview of S70GL02GT12FHIV10 by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
S70GL02GT12FHIV10 Information
S70GL02GT12FHIV10 by Infineon Technologies AG is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S70GL02GT12FHIV10
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
62AK6014
|
Newark | Flash Memory, 2Gbit, 85Deg C, Fbga-64, Flash Memory Type:Parallel Nor, Memory Configuration:256M X 8Bit/128M X 16Bit, Interfaces:Parallel, Ic Case/Package:Fbga, No. Of Pins:64Pins, Clock Frequency Max:-, Access Time:120Ns Rohs Compliant: Yes |Infineon S70GL02GT12FHIV10 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 55 |
|
$21.2800 / $25.5300 | Buy Now |
|
DISTI #
448-S70GL02GT12FHIV10-ND
|
DigiKey | IC FLASH 2GBIT PARALLEL 64FBGA Min Qty: 1 Lead time: 10 Weeks Container: Tray |
199 In Stock |
|
$21.8580 / $26.9000 | Buy Now |
|
DISTI #
S70GL02GT12FHIV10
|
Avnet Americas | - Trays (Alt: S70GL02GT12FHIV10) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 10 Weeks, 0 Days Container: Tray | 40 |
|
$20.7168 / $26.0778 | Buy Now |
|
DISTI #
727-S70GL02GT12FHV10
|
Mouser Electronics | NOR Flash PNOR RoHS: Compliant | 221 |
|
$21.4500 / $26.8700 | Buy Now |
|
DISTI #
SP005671091
|
EBV Elektronik | (Alt: SP005671091) RoHS: Compliant Min Qty: 180 Package Multiple: 180 Lead time: 11 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for S70GL02GT12FHIV10
S70GL02GT12FHIV10 CAD Models
S70GL02GT12FHIV10 Part Data Attributes
|
|
S70GL02GT12FHIV10
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
S70GL02GT12FHIV10
Infineon Technologies AG
Flash, 128MX16, 120ns, PBGA64, FBGA-64
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-64 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 10 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 120 ns | |
| Alternate Memory Width | 8 | |
| Command User Interface | NO | |
| Common Flash Interface | Y | |
| Data Polling | YES | |
| Data Retention Time-Min | ||
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 2K | |
| Number of Terminals | 64 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Page Size | 16/32 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 3 V | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.4 mm | |
| Sector Size | 128K | |
| Standby Current-Max | 0.0002 A | |
| Supply Current-Max | 0.16 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | NO | |
| Type | NOR TYPE | |
| Width | 11 mm |
S70GL02GT12FHIV10 Frequently Asked Questions (FAQ)
-
A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or perform thermal simulations to ensure optimal design.
-
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or thermal management system to keep the device within the recommended temperature range.
-
Operating the device at the maximum junction temperature can reduce its lifespan and affect its reliability. It's essential to ensure that the device operates within the recommended temperature range to maintain its performance and longevity.
-
To prevent ESD damage, handle the device with an ESD wrist strap or mat, and ensure that the assembly process is ESD-protected. Use ESD-protected packaging and follow proper handling procedures to prevent damage during transportation and storage.
-
Store the device in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C, and the relative humidity should be below 60%. Use anti-static packaging and follow proper storage procedures to prevent damage.