Datasheets
S4MF06607BSPZQQ1 by: Texas Instruments

16/32-bit RISC Flash microcontroller 100-LQFP -40 to 125

Part Details for S4MF06607BSPZQQ1 by Texas Instruments

Results Overview of S4MF06607BSPZQQ1 by Texas Instruments

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S4MF06607BSPZQQ1 Information

S4MF06607BSPZQQ1 by Texas Instruments is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for S4MF06607BSPZQQ1

Part # Distributor Description Stock Price Buy
DISTI # 296-29463-ND
DigiKey IC MCU 16/32B 640KB FLSH 100LQFP Min Qty: 1 Lead time: 18 Weeks Container: Tray 330
In Stock
  • 1 $14.7100
  • 10 $11.6270
  • 90 $10.0619
  • 180 $9.7373
  • 270 $9.5748
  • 540 $9.3364
  • 1,080 $9.1403
$9.1403 / $14.7100 Buy Now
DISTI # 595-S4MF06607BSPZQQ1
Mouser Electronics ARM Microcontrollers - MCU 16/32B RISC Fl MCU RoHS: Compliant 180
  • 1 $16.7400
  • 10 $13.1400
  • 25 $12.6000
  • 90 $11.1000
  • 270 $10.5500
  • 450 $9.8700
$9.8700 / $16.7400 Buy Now
DISTI # V99:2348_07315708
Arrow Electronics MCU 16-bit/32-bit ARM Cortex M3 RISC 640KB Flash 1.55V/3.3V Automotive AEC-Q100 100-Pin LQFP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 18 Weeks Date Code: 2315 Americas - 86
  • 1 $8.9120
  • 10 $8.4380
  • 25 $8.3950
  • 90 $8.1780
$8.1780 / $8.9120 Buy Now
DISTI # 70322944
Verical MCU 16-bit/32-bit ARM Cortex M3 RISC 640KB Flash 1.55V/3.3V Automotive AEC-Q100 100-Pin LQFP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2315 Americas - 86
  • 1 $8.9120
$8.9120 Buy Now
Ameya Holding Limited IC MCU ARM 640KB FLASH 100LQFP 1727
RFQ
Vyrian Peripheral ICs 141
RFQ
Win Source Electronics IC MCU 32BIT 640KB FLASH 100LQFP / MCU 16-bit/32-bit ARM Cortex M3 RISC 640KB Flash 1.55V/3.3V Automotive 100-Pin LQFP Tray 7868
  • 4 $16.6654
  • 9 $13.6742
  • 14 $13.2469
  • 19 $12.8196
  • 24 $12.3922
  • 32 $11.1103
$11.1103 / $16.6654 Buy Now

Part Details for S4MF06607BSPZQQ1

S4MF06607BSPZQQ1 CAD Models

S4MF06607BSPZQQ1 Part Data Attributes

S4MF06607BSPZQQ1 Texas Instruments
Buy Now Datasheet
Compare Parts:
S4MF06607BSPZQQ1 Texas Instruments 16/32-bit RISC Flash microcontroller 100-LQFP -40 to 125
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code QFP
Package Description LQFP-100
Pin Count 100
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer Texas Instruments
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan YES
CPU Family CORTEX-M3
Clock Frequency-Max 20 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PQFP-G100
JESD-609 Code e4
Length 14 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of DMA Channels
Number of External Interrupts 4
Number of I/O Lines 49
Number of Serial I/Os 4
Number of Terminals 100
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 65536
RAM (words) 64
ROM (words) 524288
ROM Programmability FLASH
Screening Level AEC-Q100
Seated Height-Max 1.6 mm
Speed 80 MHz
Supply Current-Max 110 mA
Supply Voltage-Max 1.32 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

S4MF06607BSPZQQ1 Related Parts

S4MF06607BSPZQQ1 Frequently Asked Questions (FAQ)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.

  • To ensure reliable operation across the full temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.

  • To mitigate EMI and RFI, use a multi-layer PCB with a solid ground plane, keep signal traces short and away from the device, use shielding or filtering on sensitive signals, and consider using a common-mode choke or ferrite bead on the power supply lines.

  • To optimize the device for low power consumption, use the lowest possible voltage supply, minimize switching frequencies, use power-saving modes when possible, and consider using a low-dropout regulator (LDO) or a switching regulator with high efficiency.

  • Recommended testing and validation procedures include functional testing, parametric testing, and environmental testing (temperature, humidity, vibration, etc.). It is also essential to validate the device's performance under various operating conditions, including voltage, current, and frequency.

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