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16/32-bit RISC Flash microcontroller 100-LQFP -40 to 125
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
S4MF06607BSPZQQ1 by Texas Instruments is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
296-29463-ND
|
DigiKey | IC MCU 16/32B 640KB FLSH 100LQFP Min Qty: 1 Lead time: 18 Weeks Container: Tray |
330 In Stock |
|
$9.1403 / $14.7100 | Buy Now |
DISTI #
595-S4MF06607BSPZQQ1
|
Mouser Electronics | ARM Microcontrollers - MCU 16/32B RISC Fl MCU RoHS: Compliant | 180 |
|
$9.8700 / $16.7400 | Buy Now |
DISTI #
V99:2348_07315708
|
Arrow Electronics | MCU 16-bit/32-bit ARM Cortex M3 RISC 640KB Flash 1.55V/3.3V Automotive AEC-Q100 100-Pin LQFP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 18 Weeks Date Code: 2315 | Americas - 86 |
|
$8.1780 / $8.9120 | Buy Now |
DISTI #
70322944
|
Verical | MCU 16-bit/32-bit ARM Cortex M3 RISC 640KB Flash 1.55V/3.3V Automotive AEC-Q100 100-Pin LQFP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2315 | Americas - 86 |
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$8.9120 | Buy Now |
|
Ameya Holding Limited | IC MCU ARM 640KB FLASH 100LQFP | 1727 |
|
RFQ | |
|
Vyrian | Peripheral ICs | 141 |
|
RFQ | |
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Win Source Electronics | IC MCU 32BIT 640KB FLASH 100LQFP / MCU 16-bit/32-bit ARM Cortex M3 RISC 640KB Flash 1.55V/3.3V Automotive 100-Pin LQFP Tray | 7868 |
|
$11.1103 / $16.6654 | Buy Now |
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S4MF06607BSPZQQ1
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
S4MF06607BSPZQQ1
Texas Instruments
16/32-bit RISC Flash microcontroller 100-LQFP -40 to 125
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | QFP | |
Package Description | LQFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | YES | |
CPU Family | CORTEX-M3 | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
JESD-30 Code | S-PQFP-G100 | |
JESD-609 Code | e4 | |
Length | 14 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | ||
Number of External Interrupts | 4 | |
Number of I/O Lines | 49 | |
Number of Serial I/Os | 4 | |
Number of Terminals | 100 | |
On Chip Data RAM Width | 8 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP100,.63SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
RAM (words) | 64 | |
ROM (words) | 524288 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.6 mm | |
Speed | 80 MHz | |
Supply Current-Max | 110 mA | |
Supply Voltage-Max | 1.32 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
To ensure reliable operation across the full temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
To mitigate EMI and RFI, use a multi-layer PCB with a solid ground plane, keep signal traces short and away from the device, use shielding or filtering on sensitive signals, and consider using a common-mode choke or ferrite bead on the power supply lines.
To optimize the device for low power consumption, use the lowest possible voltage supply, minimize switching frequencies, use power-saving modes when possible, and consider using a low-dropout regulator (LDO) or a switching regulator with high efficiency.
Recommended testing and validation procedures include functional testing, parametric testing, and environmental testing (temperature, humidity, vibration, etc.). It is also essential to validate the device's performance under various operating conditions, including voltage, current, and frequency.