Datasheets
S34ML01G100TFI000 by:
Spansion

Flash, 128MX8, 25ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, MO-142DDD, TSOP1-48

Part Details for S34ML01G100TFI000 by Spansion

Results Overview of S34ML01G100TFI000 by Spansion

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Applications Consumer Electronics

S34ML01G100TFI000 Information

S34ML01G100TFI000 by Spansion is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for S34ML01G100TFI000

Part # Distributor Description Stock Price Buy
Bristol Electronics   135
RFQ
Quest Components FLASH, 128MX8, 25NS, PDSO48 482
  • 1 $6.0000
  • 68 $2.6000
  • 193 $2.4000
$2.4000 / $6.0000 Buy Now
Quest Components FLASH, 128MX8, 25NS, PDSO48 2
  • 1 $8.8650
  • 2 $7.3875
$7.3875 / $8.8650 Buy Now
Vyrian Memory ICs 102
RFQ

Part Details for S34ML01G100TFI000

S34ML01G100TFI000 CAD Models

S34ML01G100TFI000 Part Data Attributes

S34ML01G100TFI000 Spansion
Buy Now Datasheet
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S34ML01G100TFI000 Spansion Flash, 128MX8, 25ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, MO-142DDD, TSOP1-48
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer SPANSION INC
Package Description 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, MO-142DDD, TSOP1-48
Reach Compliance Code compliant
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Samacsys Manufacturer Spansion
Access Time-Max 25 ns
Command User Interface YES
Common Flash Interface NO
Data Polling NO
Data Retention Time-Min 10
JESD-30 Code R-PDSO-G48
JESD-609 Code e3
Length 18.4 mm
Memory Density 1073741824 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 1K
Number of Terminals 48
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128MX8
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Page Size 2K words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3.3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 128K
Standby Current-Max 0.00001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit NO
Type SLC NAND TYPE
Width 12 mm

S34ML01G100TFI000 Related Parts

S34ML01G100TFI000 Frequently Asked Questions (FAQ)

  • The recommended operating voltage range for the S34ML01G100TFI000 is 2.7V to 3.6V.

  • The HOLD and HOLDA signals are used for asynchronous data transfer. When the HOLD signal is asserted, the device will tri-state its outputs and ignore any further input signals. The HOLDA signal is an acknowledgement from the device that it has released the bus. You should ensure that your design properly handles these signals to avoid data corruption or bus contention.

  • The WP pin is used to prevent accidental writes to the device. When the WP pin is tied low, the device is in write-protect mode, and any write operations will be ignored. You can use this pin to protect the device from unwanted writes, especially during power-up or power-down sequences.

  • The optimal clock frequency depends on your specific application requirements. The S34ML01G100TFI000 can operate at frequencies up to 104 MHz. You should consider factors such as data transfer rates, power consumption, and system latency when selecting a clock frequency for your design.

  • The S34ML01G100TFI000 is rated for operation up to 85°C. However, high temperatures can affect the device's performance, reliability, and data retention. You should consider using thermal management techniques, such as heat sinks or thermal interfaces, to ensure the device operates within its specified temperature range.

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