Part Details for S29GL512T10FHI010 by Cypress Semiconductor
Results Overview of S29GL512T10FHI010 by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
S29GL512T10FHI010 Information
S29GL512T10FHI010 by Cypress Semiconductor is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S29GL512T10FHI010
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SMC-S29GL512T10FHI010
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Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days Date Code: 1926 Container: Other | 180 |
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RFQ | |
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Flip Electronics | Stock, ship today | 6789 |
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RFQ | |
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New Advantage Corporation | Flash, 32MX16, 100ns, PBGA64 RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 1160 |
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$6.9900 | Buy Now |
Part Details for S29GL512T10FHI010
S29GL512T10FHI010 CAD Models
S29GL512T10FHI010 Part Data Attributes
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S29GL512T10FHI010
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
S29GL512T10FHI010
Cypress Semiconductor
Flash, 32MX16, 100ns, PBGA64, FBGA-64
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 100 ns | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM/TOP | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 2.7 V | |
| Seated Height-Max | 1.4 mm | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Type | NOR TYPE | |
| Width | 11 mm |
Alternate Parts for S29GL512T10FHI010
This table gives cross-reference parts and alternative options found for S29GL512T10FHI010. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29GL512T10FHI010, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| S29GL512T10FHI010 | Infineon Technologies AG | Check for Price | Flash, 32MX16, 100ns, PBGA64, | S29GL512T10FHI010 vs S29GL512T10FHI010 |
S29GL512T10FHI010 Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the S29GL512T10FHI010 is -40°C to +85°C.
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The hold signal (HOLD#) should be asserted low to pause the current operation and de-asserted high to resume the operation.
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The write protect (WP#) signal is used to prevent accidental writes to the device. When WP# is low, the device is in write-protect mode, and when WP# is high, the device is in write-enable mode.
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To perform a sector erase operation, send the erase command (0x20) followed by the sector address. The device will then erase the entire sector.
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The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal.