Part Details for S29GL256P11FFIV13 by Infineon Technologies AG
Results Overview of S29GL256P11FFIV13 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
S29GL256P11FFIV13 Information
S29GL256P11FFIV13 by Infineon Technologies AG is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for S29GL256P11FFIV13
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
S29GL256P11FFIV13
|
Avnet Americas | NOR Flash Parallel 3V/3.3V 256Mbit 32M/16M x 8bit/16bit 110ns 64-Pin Fortified BGA T/R - Tape and Reel (Alt: S29GL256P11FFIV13) RoHS: Compliant Min Qty: 1600 Package Multiple: 1600 Lead time: 111 Weeks, 0 Days Container: Reel | 0 |
|
$6.5500 / $6.9692 | Buy Now |
Part Details for S29GL256P11FFIV13
S29GL256P11FFIV13 CAD Models
S29GL256P11FFIV13 Part Data Attributes
|
|
S29GL256P11FFIV13
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
S29GL256P11FFIV13
Infineon Technologies AG
Flash, 256MX1, 110ns, PBGA64, FBGA-64
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-64 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 110 ns | |
| Alternate Memory Width | 1 | |
| Boot Block | BOTTOM/TOP | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 256 | |
| Number of Terminals | 64 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Page Size | 8/16 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.4 mm | |
| Sector Size | 128K | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.11 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 11 mm |
Alternate Parts for S29GL256P11FFIV13
This table gives cross-reference parts and alternative options found for S29GL256P11FFIV13. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29GL256P11FFIV13, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| S29GL256P11FFIV12 | Infineon Technologies AG | Check for Price | Flash, 256MX1, 110ns, PBGA64, FBGA-64 | S29GL256P11FFIV13 vs S29GL256P11FFIV12 |
| S29GL256P11FAI020 | Infineon Technologies AG | Check for Price | Flash, 256MX1, 110ns, PBGA64, FBGA-64 | S29GL256P11FFIV13 vs S29GL256P11FAI020 |
S29GL256P11FFIV13 Frequently Asked Questions (FAQ)
-
The maximum operating temperature range for the S29GL256P11FFIV13 is -40°C to +85°C.
-
The HOLD# signal should be asserted low to pause the current read or write operation. De-asserting HOLD# resumes the operation from where it was paused.
-
The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal (CLK).
-
The device density and configuration can be determined by reading the device ID and configuration registers using the appropriate commands.
-
The WP# signal is used to protect the entire memory array or specific sectors from unintentional writes or erases.