Part Details for S29GL256P11FFI022 by Cypress Semiconductor
Results Overview of S29GL256P11FFI022 by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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S29GL256P11FFI022 Information
S29GL256P11FFI022 by Cypress Semiconductor is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for S29GL256P11FFI022
S29GL256P11FFI022 CAD Models
S29GL256P11FFI022 Part Data Attributes
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S29GL256P11FFI022
Cypress Semiconductor
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Datasheet
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S29GL256P11FFI022
Cypress Semiconductor
Flash, 256MX1, 110ns, PBGA64, FBGA-64
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | FBGA-64 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 110 ns | |
| Alternate Memory Width | 1 | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 256 | |
| Number of Terminals | 64 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Page Size | 8/16 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.4 mm | |
| Sector Size | 128K | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.11 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 11 mm |
Alternate Parts for S29GL256P11FFI022
This table gives cross-reference parts and alternative options found for S29GL256P11FFI022. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29GL256P11FFI022, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
S29GL256P11FFI022 Frequently Asked Questions (FAQ)
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The S29GL256P11FFI022 has an industrial temperature range of -40°C to +85°C, and an extended temperature range of -40°C to +105°C.
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The HOLD# signal should be asserted low to pause the current read or write operation, and de-asserted high to resume the operation. Note that HOLD# should not be asserted during erase or program operations.
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The recommended power-up sequence is to apply VCC first, followed by VCCQ, and then the clock signal (CLK). This ensures that the device is properly initialized and ready for operation.
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The device density and configuration can be determined by reading the device ID and configuration registers. The device ID is read using the JEDEC ID command (0x9F), and the configuration registers are read using the Read Configuration Register command (0x35).
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The Write Enable Latch (WEL) bit is used to enable or disable write operations to the device. When WEL is set to 1, write operations are enabled, and when WEL is set to 0, write operations are disabled.